參數(shù)資料
型號: DEMO-HMPP-389T
英文描述: Demonstration circuit board for HMPP-389T
中文描述: 論證HMPP電路板- 389T
文件頁數(shù): 1/11頁
文件大?。?/td> 159K
代理商: DEMO-HMPP-389T
Agilent HMPP-389x Series
MiniPak Surface Mount
RF PIN Switch Diodes
Data Sheet
Description/Applications
These ultra-miniature products
represent the blending of Agilent
Technologies’ proven semiconduc-
tor and the latest in leadless
packaging technology.
The HMPP-389x series is optimized
for switching applications where
low resistance at low current and
low capacitance are required. The
MiniPak package offers reduced
parasitics when compared to
conventional leaded diodes, and
lower thermal resistance.
Features
Surface mount MiniPak package
– low height, 0.7 mm (0.028") max.
– small footprint, 1.75 mm
2
(0.0028 inch
2
)
Better thermal conductivity for
higher power dissipation
Single and dual versions
Matched diodes for consistent
performance
Low capacitance
Low resistance at low current
Low FIT (Failure in Time) rate*
Six-sigma quality level
* For more information, see the Surface
Mount Schottky Reliability Data Sheet.
Pin Connections and
Package Marking
3
2
Product code
Date code
4
AA
1
Package Lead Code Identification
(Top View)
Single
3
2
4
1
#0
Anti-parallel
3
2
4
1
#2
Parallel
3
2
4
1
#5
Shunt Switch
Cathode
3
2
4
1
T
Anode
Cathode
Anode
Low junction capacitance of the
PIN diode chip, combined with
ultra low package parasitics, mean
that these products may be used
at frequencies which are higher
than the upper limit for conven-
tional PIN diodes.
Note that Agilent
s manufacturing
techniques assure that dice
packaged in pairs are taken from
adjacent sites on the wafer,
assuring the highest degree of
match.
The HMPP-389T low inductance
wide band shunt switch is well
suited for applications up to 6 GHz.
Notes:
1. Package marking provides orientation and
identification.
2. See “Electrical Specifications” for
appropriate package marking.
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