參數(shù)資料
型號: DDX2100
文件頁數(shù): 7/9頁
文件大小: 515K
代理商: DDX2100
DDX-2100
Power Dissipation/Heat Sink
Requirements
The power dissipation of the device will depend
primarily on the supply voltage, load impedance,
and output modulation level.
The DDX-2100 surface mount package includes
an exposed thermal pad on the top of the device
to provide a direct thermal path from the
integrated circuit to the heatsink. This pad should
be fastened to a low thermal impedance path at
circuit ground potential for proper operation.. For
continuous duty rated applications, careful
consideration must be made to the overall thermal
design.
For additional thermal design considerations, see
http://www.apogeeddx.com/DDX_Themal_Consid
erations.PDF
Typical Performance Characteristics at
Vcc=36V
Figure 5: Efficiency
0
10
20
30
40
50
60
70
80
90
100
0
10
20
30
40
50
60
70
80
90
100
110
120
Total Output Power (Watts)
E
Figure 6: Frequency Response
-3
+3
-1.5
-0
+1.5
d
B
r
A
20
20k
50
100
200
500
1k
2k
5k
10k
Hz
7
Document #11010001-01
November 2001
PRELIMINARY – subject to change without notice
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