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參數(shù)資料
| 型號： | DC34 |
| 廠商： | 上海朗碩科技有限公司 |
| 英文描述： | SILICON BIDIRECTIONAL DIAC |
| 中文描述： | 硅雙向移民部 |
| 文件頁數(shù)： | 4/4頁 |
| 文件大?。?/td> | 43K |
| 代理商： | DC34 |
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from itsuse. No
license is granted by implication or otherwise under any patent or patentrights ofSGS-THOMSON Microelectronics. Specifications mentioned
in thispublication are subject to change without notice. This publication supersedesand replaces all information previously supplied.
SGS-THOMSON Microelectronics products are notauthorized foruse as critical componentsinlife support devices or systemswithout express
written approval of SGS-THOMSON Microelectronics.
1995 SGS-THOMSON Microelectronics - All rights reserved.
Purchase of I
2
C Components by SGS-THOMSON Microelectronics, conveys a license under the Philips
I
2
C Patent. Rights to use these components in anI
C system, is granted provided thatthe system conforms to
the I
C Standard Specifications as defined by Philips.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan- Korea - Malaysia - Malta -Morocco - The Netherlands -
Singapore - Spain - Sweden- Switzerland - Taiwan - Thailand - UnitedKingdom -U.S.A.
Cooling method by convection and conduction
Marking: typenumber
Weight : 0.15g
PACKAGEMECHANICAL DATA
(in millimeters)
DO 35 Glass
Polarity : N A
Stud torque: N A
note 2
B
A
B
C
note 1
note 1
D
D
O
/
O
/
O
/
E
E
REF.
DIMENSIONS
NOTES
Millimeters
Inches
Min.
Max.
Min.
Max.
A
3.050
4.500
0.120
0.117
1 - The lead diameter
Dis not controlledoverzone E
2 - The minimum axiallengh within which the devicemay be
placedwith its leads bent at rightanglesis 0.59”(15 mm)
B
12.7
0.500
C
1.530
2.000
0.060
0.079
D
0.458
0.558
0.018
0.022
E
1.27
0.050
DB3 / DB4/ DC34
4/4
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