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參數(shù)資料
| 型號： | DC1826A-A |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 16/26頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD SAR ADC LTC2389-18 |
| 軟件下載： | QuikEval II System |
| 設計資源： | DC1826A Schematic DC1826A Design Files |
| 標準包裝： | 1 |
| 系列： | QuikEval-II™ |
| ADC 的數(shù)量： | 1 |
| 位數(shù)： | 18 |
| 采樣率（每秒）： | 2.5M |
| 數(shù)據(jù)接口： | 串行，并聯(lián) |
| 輸入范圍： | ±4.096 V |
| 在以下條件下的電源（標準）： | 162.5mW @ 2.5MSPS |
| 工作溫度： | 0°C ~ 70°C |
| 已用 IC / 零件： | LTC2389-18 |
| 已供物品： | 板 |
| 相關產(chǎn)品： | LTC2389IUK-18#TRPBF-ND - IC ADC 18BIT PAR/SRL 2.5M 48-QFN LTC2389HLX-18#PBF-ND - IC ADC 18BIT PAR/SRL 2.5M 48LQFP LTC2389CUK-18#TRPBF-ND - IC ADC 18BIT PAR/SRL 2.5M 48-QFN LTC2389CUK-18#PBF-ND - IC ADC 18BIT PAR/SRL 2.5M 48-QFN LTC2389CLX-18#PBF-ND - IC ADC 18BIT PAR/SRL 2.5M 48LQFP LTC2389IUK-18#PBF-ND - IC ADC SAR 48QFN LTC2389ILX-18#PBF-ND - IC ADC SAR 48LQFP DC718C-ND - DEMO QUIKEVAL-II DATA |
23
62001ff
LT6200/LT6200-5
LT6200-10/LT6201
package DescripTion
S6 Package
6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636)
DD Package
8-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
3.00
±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65
± 0.10
(2 SIDES)
0.75
±0.05
R = 0.125
TYP
2.38
±0.10
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25
± 0.05
2.38
±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65
±0.05
(2 SIDES)
2.10
±0.05
0.50
BSC
0.70
±0.05
3.5
±0.05
PACKAGE
OUTLINE
0.25
± 0.05
0.50 BSC
1.50 – 1.75
(NOTE 4)
2.80 BSC
0.30 – 0.45
6 PLCS (NOTE 3)
DATUM ‘A’
0.09 – 0.20
(NOTE 3)
S6 TSOT-23 0302 REV B
2.90 BSC
(NOTE 4)
0.95 BSC
1.90 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.10
0.20 BSC
0.30 – 0.50 REF
PIN ONE ID
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
3.85 MAX
0.62
MAX
0.95
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.4 MIN
2.62 REF
1.22 REF
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
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