參數(shù)資料
型號(hào)： DC1813A-G
廠商： Linear Technology
文件頁數(shù)： 15/28頁
文件大小： 0K
描述： BOARD SAR ADC LTC2367-18
軟件下載： QuikEval II System
設(shè)計(jì)資源： DC1813A Design File
DC1813A Schematic
標(biāo)準(zhǔn)包裝： 1
系列： QuikEval-II™
ADC 的數(shù)量： 1
位數(shù)： 18
采樣率（每秒）： 500k
數(shù)據(jù)接口： 串行，SPI?
輸入范圍： 0 ~ VREF
在以下條件下的電源（標(biāo)準(zhǔn)）： 6.75mW @ 500kSPS
工作溫度： 0°C ~ 70°C
已用 IC / 零件： LTC2367-18
已供物品： 板
相關(guān)產(chǎn)品： LTC2367IMS-18#TRPBF-ND - IC ADC 18BIT 500K 1CH 16MSOP
LTC2367IMS-18#PBF-ND - IC ADC 18BIT 500K 1CH 16MSOP
LTC2367IDE-18#TRPBF-ND - IC ADC 18BIT 500K 1CH 16DFN
LTC2367IDE-18#PBF-ND - IC ADC 18BIT 500K 1CH 16DFN
LTC2367HMS-18#TRPBF-ND - IC ADC 18BIT 500K 1CH 16MSOP
LTC2367HMS-18#PBF-ND - IC ADC 18BIT 500K 1CH 16MSOP
LTC2367CMS-18#TRPBF-ND - IC ADC 18BIT 500K 1CH 16MSOP
LTC2367CDE-18#TRPBF-ND - IC ADC 18BIT 500K 1CH 16DFN
LTC2367CDE-18#PBF-ND - IC ADC 18BIT SPI/SRL 500K 16DFN
LTC2367CMS-18#PBF-ND - IC ADC 18BIT SPI/SRL 500K 16MSOP
更多...
LT6202/LT6203/LT6204
22
620234fd
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
PACKAGE DESCRIPTION
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
3.00
±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65
± 0.10
(2 SIDES)
0.75
±0.05
R = 0.125
TYP
2.38
±0.10
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25
± 0.05
2.38
±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65
±0.05
(2 SIDES)
2.10
±0.05
0.50
BSC
0.70
±0.05
3.5
±0.05
PACKAGE
OUTLINE
0.25
± 0.05
0.50 BSC
GN16 (SSOP) 0204
1 2 3 4 5 6 7 8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16 15 14 13
.189 – .196*
(4.801 – 4.978)
12 11 10 9
.016 – .050
(0.406 – 1.270)
.015 ±.004
(0.38 ±0.10)
× 45°
0° – 8° TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC
.0165 ±.0015
.045 ±.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
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