參數(shù)資料
型號(hào)： DC1813A-E
廠商： Linear Technology
文件頁數(shù)： 15/24頁
文件大?。?/td> 0K
描述： BOARD SAR ADC LTC2369-18
軟件下載： QuikEval II System
設(shè)計(jì)資源： DC1813A Schematic
DC1813A Design File
標(biāo)準(zhǔn)包裝： 1
系列： QuikEval-II™
ADC 的數(shù)量： 1
位數(shù)： 18
采樣率（每秒）： 1.6M
數(shù)據(jù)接口： 串行，SPI?
輸入范圍： 0 ~ VREF
在以下條件下的電源（標(biāo)準(zhǔn)）： 18mW @ 1.6MSPS
工作溫度： 0°C ~ 70°C
已用 IC / 零件： LTC2369-18
已供物品： 板
相關(guān)產(chǎn)品： LT6202HS5#TRPBF-ND - IC OP AMP RRIO 100MHZ TSOT23-5
LT6202HS5#TRMPBF-ND - IC OP AMP RRIO 100MHZ TSOT23-5
LTC2369IDE-18#PBF-ND - IC ADC 18BIT 1.6M 16-DFN
LTC2369IMS-18#PBF-ND - IC ADC 18BIT 1.6M 16-MSOP
LTC2369CMS-18#PBF-ND - IC ADC 18BIT SRL/SPI 16-MSOP
LTC2369CDE-18#TRPBF-ND - IC ADC 18BIT SRL/SPI 1.6M 16-DFN
LTC2369CDE-18#PBF-ND - IC ADC 18BIT SRL/SPI 1.6M 16-DFN
LTC2369IMS-18#TRPBF-ND - IC ADC 18BIT SRL/SPI 16-MSOP
LTC2369IDE-18#TRPBF-ND - IC ADC 18BIT SRL/SPI 1.6M 16-DFN
LTC2369HMS-18#TRPBF-ND - IC ADC 18BIT SRL/SPI 16-MSOP
更多...
LTC2369-18
22
236918fa
3.00 ±0.10
(2 SIDES)
4.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
0.75 ±0.05
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
1.70 ± 0.05
3.15 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.20 ±0.05
0.70 ±0.05
3.60 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
3.30 ±0.05
0.45 BSC
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.70 ± 0.10
R = 0.115
TYP
R = 0.05
TYP
3.15 REF
1
8
16
9
(DE16) DFN 0806 REV
PIN 1 NOTCH
R = 0.20 OR
0.35
× 45°
CHAMFER
3.30 ±0.10
0.23 ± 0.05
0.45 BSC
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
DE Package
16-Lead Plastic DFN (4mm
× 3mm)
(Reference LTC DWG # 05-08-1732 Rev )
MS Package
16-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1669 Rev )
MSOP (MS16) 1107 REV
0.53
± 0.152
(.021
± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
16151413121110
1234567 8
9
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
0.254
(.010)
0
° – 6° TYP
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
± 0.127
(.035
± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305
± 0.038
(.0120
± .0015)
TYP
0.50
(.0197)
BSC
4.039
± 0.102
(.159
± .004)
(NOTE 3)
0.1016
± 0.0508
(.004
± .002)
3.00
± 0.102
(.118
± .004)
(NOTE 4)
0.280
± 0.076
(.011
± .003)
REF
4.90
± 0.152
(.193
± .006)
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
相關(guān)PDF資料
PDF描述
FPF2002 IC SW LOAD FULL FUNC 50MA SC70-5
DC1783A-F BOARD SAR ADC LTC2378-18
GCM30DCWH CONN EDGECARD 60POS DIP .156 SLD
GCM30DCWD CONN EDGECARD 60POS DIP .156 SLD
GBM22DCCT CONN EDGECARD 44POS R/A .156 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DC1813A-F 功能描述:BOARD SAR ADC LTC2368-18 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評(píng)估板 - 模數(shù)轉(zhuǎn)換器 (ADC) 系列:QuikEval-II™ 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- ADC 的數(shù)量:1 位數(shù):12 采樣率（每秒）:94.4k 數(shù)據(jù)接口:USB 輸入范圍:±VREF/2 在以下條件下的電源（標(biāo)準(zhǔn)）:- 工作溫度:-40°C ~ 85°C 已用 IC / 零件:MAX11645 已供物品:板，軟件
DC1813A-G 功能描述:BOARD SAR ADC LTC2367-18 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評(píng)估板 - 模數(shù)轉(zhuǎn)換器 (ADC) 系列:QuikEval-II™ 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- ADC 的數(shù)量:1 位數(shù):12 采樣率（每秒）:94.4k 數(shù)據(jù)接口:USB 輸入范圍:±VREF/2 在以下條件下的電源（標(biāo)準(zhǔn)）:- 工作溫度:-40°C ~ 85°C 已用 IC / 零件:MAX11645 已供物品:板，軟件
DC1813A-H 功能描述:BOARD SAR ADC LTC2364-18 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評(píng)估板 - 模數(shù)轉(zhuǎn)換器 (ADC) 系列:QuikEval-II™ 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- ADC 的數(shù)量:1 位數(shù):12 采樣率（每秒）:94.4k 數(shù)據(jù)接口:USB 輸入范圍:±VREF/2 在以下條件下的電源（標(biāo)準(zhǔn)）:- 工作溫度:-40°C ~ 85°C 已用 IC / 零件:MAX11645 已供物品:板，軟件
DC1814A-A 制造商:Linear Technology 功能描述:BOARD EVAL FOR LTC4274A-1 制造商:Linear Technology 功能描述:LTC4274A LTPOE++ PSE CTRL EVAL BOARD 制造商:Linear Technology 功能描述:DEMO BOARD, LTC4274A-1 POWER OVER ETHERNET (POE), Silicon Manufacturer:Linear Technology, Silicon Core Number:LTC4274A-1, Kit Application Type:Power Management, Application Sub Type:Power Over Ethernet (POE)
DC1814A-B 制造商:Linear Technology 功能描述:BOARD EVAL FOR LTC4274A-2 制造商:Linear Technology 功能描述:LTC4274A LTPOE++ PSE CTRL EVAL BOARD 制造商:Linear Technology 功能描述:LTC4274A, LTPOE++ PSE CTRL, EVAL BOARD 制造商:Linear Technology 功能描述:DEMO BOARD, LTC4274A-2 POWER OVER ETHERNET (POE), Silicon Manufacturer:Linear Te 制造商:Linear Technology 功能描述:DEMO BOARD, LTC4274A-2 POWER OVER ETHERNET (POE), Silicon Manufacturer:Linear Technology, Silicon Core Number:LTC4274A-2, Kit Application Type:Power Management, Application Sub Type:Power Over Ethernet (POE)
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*