參數(shù)資料
型號： DAC7801LU
廠商： Texas Instruments
文件頁數(shù)： 12/23頁
文件大?。?/td> 0K
描述： IC DAC 12BIT DUAL MULT 24-SOIC
產(chǎn)品培訓模塊： Data Converter Basics
標準包裝： 25
設置時間： 400ns
位數(shù)： 12
數(shù)據(jù)接口： 并聯(lián)
轉(zhuǎn)換器數(shù)目： 2
電壓電源： 單電源
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 24-SOIC（0.295"，7.50mm 寬）
供應商設備封裝： 24-SOIC
包裝： 管件
輸出數(shù)目和類型： 2 電流，單極；2 電流，雙極
產(chǎn)品目錄頁面： 900 (CN2011-ZH PDF)
其它名稱： 296-18289-5
DAC7801LU-ND
DAC7800, 7801, 7802
2
SBAS005A
www.ti.com
SPECIFIED
RELATIVE
GAIN
PACKAGE
TEMPERATURE
PACKAGE
ORDERING
TRANSPORT
PRODUCT
ACCURACY
ERROR
PACKAGE-LEAD
DESIGNATOR(1)
RANGE
MARKING
NUMBER
MEDIA, QUANTITY
DAC7800KP
±1LSB
±3LSB
DIP-16
N
–40
°C to +85°C
DAC7800KP
Rails, 25
DAC7800LP
±1/2 LSB
±1LSB
DIP-16
N
DAC7800LP
Rails, 25
DAC7800KU
——
SO-16
DW
–40
°C to +85°C
DAC7800KU DAC7800KU/1K Tape and Reel, 1000
DAC7800LU
——
SO-16
DW
DAC7800LU
DAC7800LU/1K Tape and Reel, 1000
DAC7801KP
±1LSB
±3LSB
DIP-24
NTG
–40
°C to +85°C
DAC7801KP
Rails, 15
DAC7801LP
±1/2 LSB
±1LSB
DIP-24
NTG
DAC7801LP
Rails, 15
DAC7801KU
——
SO-24
DW
–40
°C to +85°C
DAC7801KU DAC7801KU/1K Tape and Reel, 1000
DAC7801LU
——
SO-24
DW
DAC7801LU
DAC7801LU/1K Tape and Reel, 1000
DAC7802KP
±1LSB
±3LSB
DIP-24
NTG
–40
°C to +85°C
DAC7802KP
Rails, 15
DAC7802LP
±1/2 LSB
±1LSB
DIP-24
NTG
DAC7802LP
Rails, 15
DAC7802KU
——
SO-24
DW
–40
°C to +85°C
DAC7802KU DAC7802KU/1K Tape and Reel, 1000
DAC7802LU
——
SO-24
DW
DAC7802LU
DAC7802LU/1K Tape and Reel, 1000
NOTE: (1 ) For the most current specifications and package information, see the package option addendum located at the end of this data sheet.
ELECTRICAL CHARACTERISTICS
At VDD = +5VDC, VREF A = VREF B = +10V, TA = –40°C to +85°C, unless otherwise noted.
DAC7800, 7801, 7802K
DAC7800, 7801, 7802L
PARAMETER
CONDITIONS
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
ACCURACY
Resolution
12
Bits
Relative Accuracy
±1
±1/2
LSB
Differential Nonlinearity
±1
LSB
Gain Error
Measured Using RFB A and RFB B.
±3
±1
LSB
All Registers Loaded with All 1s.
Gain Temperature Coefficient(1)
25
ppm/
°C
Output Leakage Current
TA = +25°C
0.005
10
nA
TA = –40°C to +85°C
3
150
nA
REFERENCE INPUT
Input Resistance
6
10
14
k
Input Resistance Match
0.5
3
2%
DIGITAL INPUTS
VIH (Input HIGH Voltage)
2
V
VIL (Input LOW Voltage)
0.8
V
IIN
(Input Current)
TA = +25°C
±1
A
TA = –40°C to +85°C
±10
A
CIN (Input Capacitance)
0.8
10
pF
POWER SUPPLY
VDD
4.5
5.5
V
IDD
0.2
2
mA
Power-Supply Rejection
VDD from 4.5V to 5.5V
0.002
%/%
Same specification as for DAC7800, 7801, 7802K.
VDD to AGND ............................................................................... 0V, +7V
VDD to DGND ............................................................................... 0V, +7V
AGND to DGND ....................................................................... –0.3, VDD
Digital Input to DGND ..................................................... –0.3, VDD + 0.3
VREF A, VREF B to AGND .................................................................. ±16V
VREF A, VREF B to DGND .................................................................. ±16V
IOUT A, IOUT B to AGND ............................................................. –0.3, VDD
Storage Temperature Range ....................................... –55
°C to +125°C
Operating Temperature Range ...................................... –40
°C to +85°C
Lead Temperature (soldering, 10s) .............................................. +300
°C
Junction Temperature ................................................................... +175
°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliaiblity.
ABSOLUTE MAXIMUM RATINGS(1)
At TA = +25°C, unless otherwise noted.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
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