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參數(shù)資料
| 型號： | DAC667JP |
| 英文描述： | IC-12-BIT DAC |
| 中文描述： | 集成電路12位DAC |
| 文件頁數(shù)： | 3/9頁 |
| 文件大?。?/td> | 218K |
| 代理商： | DAC667JP |
3
DAC667
TIMING SPECIFICATIONS
SYMBOL
PARAMETER
MIN
TYP
MAX
UNITS
t
DC
t
AC
t
CP
t
DH
t
SETT
Data Valid to End of CS
Address Valid to End of CS
CS Pulse Width
Data Hold Time
Output Voltage Settling Time
50
100
100
0
–
–
–
–
–
2
–
–
–
–
4
ns
ns
ns
ns
μ
s
All models, T
A
= +25
°
C, V
CC
= +12V or +15V, V
EE
= –12V or –15V.
ABSOLUTE MAXIMUM RATINGS
V
CC
to Power Ground ..............................................................0V to +18V
V
to Power Ground ..............................................................0V to –18V
Digital Inputs (Pins 11–15, 17–28) to Power Ground.............–1V to +7V
Ref In to Reference Ground..............................................................
±
12V
Bipolar Offset to Reference Ground .................................................
±
12V
10V Span Resistor to Reference Ground .........................................
±
12V
20V Span Resistor to Reference Ground .........................................
±
24V
Ref Out, V
OUT
(Pins 6, 9) ....................Indefinite Short to Power Ground,
Momentary Short To V
CC
Power Dissipation ........................................................................1000mW
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
TEMPERATURE
RANGE
LINEARITY ERROR
max at 25
°
C
±
1/2LSB
GAIN TC, max
(ppm/
°
C)
±
30
PACKAGE DRAWING
NUMBER
(1)
PRODUCT
PACKAGE
DAC667JP
28-Pin Plastic DIP
0
°
C to +70
°
C
215
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.
TIMING DIAGRAMS
Load first rank from Data Bus; A3 = 1.
t
Write Cycle #1
t
SETT
CS
±1/2LSB
A3
t
AC
t
CP
Load second rank from first rank; A2, A1, A0 = 1.
Write Cycle #2
Output
CS
A2–A0
t
AC
t
DC
t
DH
t
CP
DB11–DB0
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DAC667KP | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:BURR-BROWN 功能描述: 制造商:Texas Instruments 功能描述: |
| DAC-6-CG | 制造商:Thomas & Betts 功能描述:2" RIGID TF CONDUIT BODY 制造商:Thomas & Betts 功能描述:Universal Recessed Box And Cover |
| DAC70 | 制造商:BB 制造商全稱:BB 功能描述:Monlithic 16-bit digital-to-analog converters |
| DAC700 WAF | 制造商:Texas Instruments 功能描述: |
| DAC70004IDMDT | 功能描述:14 Bit Digital to Analog Converter 1 14-VSON (4x3) 制造商:texas instruments 系列:- 包裝:剪切帶（CT） 零件狀態(tài):新產(chǎn)品 位數(shù):14 Number of D/A Converters:1 建立時間:8μs 輸出類型:Voltage - Buffered Differential Output:無 數(shù)據(jù)接口:SPI 參考類型:內(nèi)部 電壓 - 電源，模擬:2.7 V ~ 5.5 V 電壓 - 電源，數(shù)字:2.7 V ~ 5.5 V INL/DNL (LSB):±1（最大），±1（最大） 架構(gòu):R-2R 工作溫度:-40°C ~ 125°C 封裝/外殼:14-VFDFN 裸露焊盤 供應商器件封裝:14-VSON（4x3） 標準包裝:1 |
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