參數(shù)資料
型號： DAC1205D650HW
廠商： NXP Semiconductors N.V.
元件分類： 外設(shè)及接口
英文描述： Dual 12-bit DAC, up to 650 Msps; 2x 4x and 8x interpolating
封裝： DAC1205D650HW/C1<SOT638-1 (HTQFP100)|<<http://www.nxp.com/packages/SOT638-1.html<1<Always Pb-free,;DAC1205D650HW/C1<SOT638-1 (HTQFP100)|<<http://www.nxp.com/packages/SOT6
文件頁數(shù)： 12/43頁
文件大小： 295K
代理商： DAC1205D650HW
DAC1205D650
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 13 September 2010
12 of 43
NXP Semiconductors
DAC1205D650
Dual 12-bit DAC, up to 650 Msps; 2
×
4
×
and 8
×
interpolating
[1]
D = guaranteed by design; C = guaranteed by characterization; I = 100 % industrially tested.
[2]
CLKP and CLKN inputs are at differential LVDS levels. An external differential resistor with a value of between 80
Ω
and 120
Ω
should
be connected across the pins (see
Figure 8
).
[3]
|
V
gpd
|
represents the ground potential difference voltage. This is the voltage that results from current flowing through the finite resistance
and the inductance between the receiver and the driver circuit ground.
[4]
IMD3 rejection with
6 dBFS/tone.
IMD3
third-order
intermodulation
distortion
f
o1
= 49 MHz; f
o2
= 51 MHz;
f
s
= 320 Msps; 4
×
interpolation
f
o1
= 95 MHz; f
o2
= 97 MHz;
f
s
= 320 Msps; 4
×
interpolation
f
o1
= 95 MHz; f
o2
= 97 MHz;
f
s
= 640 Msps; 8
×
interpolation
f
o1
= 152 MHz; f
o2
= 154 MHz;
f
s
= 640 Msps; 8
×
interpolation
f
data
= 76.8 MHz; f
s
= 614.4 Msps;
f
o
= 96 MHz
1 carrier; B = 5 MHz
2 carriers; B = 10 MHz
4 carriers; B = 20 MHz
f
data
= 153.6 MHz; f
s
= 614.4 Msps;
f
o
= 115.2 MHz
1 carrier; B = 5 MHz
2 carriers; B = 10 MHz
4 carriers; B = 20 MHz
f
data
= 153.6 MHz; f
s
= 614.4 Msps;
f
o
= 153.6 MHz
1 carrier; B = 5 MHz
2 carriers; B = 10 MHz
4 carriers; B = 20 MHz
C
[4]
-
82
-
dBc
C
[4]
-
80
-
dBc
I
[4]
66
79
-
dBc
C
[4]
-
77
-
dBc
ACPR
adjacent channel
power ratio
I
C
C
-
-
-
70
68
67
-
-
-
dB
dB
dB
C
C
C
-
-
-
70
68
66
-
-
-
dB
dB
dB
C
C
C
-
-
-
68
66
65
-
-
-
dB
dB
dB
NSD
noise spectral density f
s
= 640 Msps; 8
×
interpolation;
f
o
= 19 MHz at 0 dBFS
noise shaper disabled
noise shaper enabled
C
C
-
-
149
150
-
-
dBm/Hz
dBm/Hz
Table 5.
V
DDA(1V8)
= V
DDD(1V8)
= 1.8 V; V
DDA(3V3)
= V
DD(IO)(3V3)
= 3.3 V; AGND, DGND and GNDIO shorted together; T
amb
=
40
°
C to
+85
°
C; typical values measured at T
amb
= 25
°
C; R
L
= 50
Ω
; I
O(fs)
= 20 mA; maximum sample rate; PLL on unless otherwise
specified.
Symbol
Parameter
Conditions
Characteristics
…continued
Test
[1]
Min
Typ
Max
Unit
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DAC1205D650HW/C1 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Dual 12-bit DAC, up to 650 Msps; 2′ 4′ and 8′ interpolating
DAC1205D650HW/C1,5 功能描述:數(shù)模轉(zhuǎn)換器- DAC IC DAC 12BIT 650MSPS DL RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
DAC1205D650HW-C1 功能描述:數(shù)模轉(zhuǎn)換器- DAC DAC RoHS:否 制造商:IDT 轉(zhuǎn)換器數(shù)量:2 DAC 輸出端數(shù)量:4 轉(zhuǎn)換速率:650 MSPs 分辨率:12 bit 接口類型:Serial, SPI 穩(wěn)定時(shí)間:20 ns 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-100 封裝:
DAC1205D650HW-C18 制造商:Integrated Device Technology Inc 功能描述:BST - Tape and Reel
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