參數(shù)資料
型號: DAC1005D750HW
廠商: NXP SEMICONDUCTORS
元件分類: DAC
英文描述: Dual 10-bit DAC, up to 750 Msps; 2x 4x and 8x interpolating
中文描述: PARALLEL, WORD INPUT LOADING, 0.02 us SETTLING TIME, 10-BIT DAC, PQFP100
封裝: 14 X 14 MM, 1 MM HEIGHT, PLASTIC, MS-026, SOT638-1, HTQFP-100
文件頁數(shù): 37/42頁
文件大?。?/td> 353K
代理商: DAC1005D750HW
DAC1005D750
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 7 June 2011
37 of 42
NXP Semiconductors
DAC1005D750
Dual 10-bit DAC, up to 750 Msps; 4x and 8x interpolating
11. Package outline
Fig 20. Package outline SOT638-1 (HTQFP100)
UNIT
A
max.
A1
A2
A3
bp
HD
HE
Lp
ZD
(1)
ZE
(1)
c
e
L
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
1.2
0.15
0.05
1.05
0.95
0.25
0.27
0.17
0.20
0.09
14.1
13.9
0.5
16.15
15.85
1.15
0.85
7
°
0
°
0.08
0.08
0.2
1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT638-1
MS-026
03-04-07
05-02-02
D
(1)
E
(1)
14.1
13.9
16.15
15.85
Dh
Eh
7.1
6.1
7.1
6.1
1.15
0.85
bp
bp
e
θ
E
A1
A
Lp
L
detail X
(A3)
B
25
HD
HE
A2
v
M
B
D
ZD
A
c
ZE
e
v
M
A
X
1
100
76
75
51
50
26
y
pin 1 index
w
M
w
M
0
10 mm
scale
HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads;
body 14 x 14 x 1 mm; exposed die pad
SOT638-1
Dh
Eh
exposed die pad side
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