參數(shù)資料
| 型號： | DA-T263-101E |
| 廠商： | Ohmite |
| 文件頁數(shù)： | 1/2頁 |
| 文件大?。?/td> | 0K |
| 描述： | HEATSINK FOR TO-263 BLACK |
| 產品培訓模塊： | Quick Heatsink Guide |
| 產品目錄繪圖： | D(A,V)-T263, 268 Series TO-263 Footprint 1 TO-263 Footprint 2 |
| 標準包裝： | 10 |
| 系列： | D |
| 類型： | 頂部安裝 |
| 冷卻式包裝： | TO-252（DPak），TO-263（D²Pak） |
| 固定方法： | 可焊底座 |
| 形狀： | 矩形 |
| 長度： | 0.500"（12.70mm） |
| 寬： | 1.020"（25.91mm） |
| 機座外的高度（散熱片高度）： | 0.400"（10.16mm） |
| 材質： | 鋁 |
| 材料表面處理： | 黑色陽極化處理 |
| 產品目錄頁面： | 2257 (CN2011-ZH PDF) |
| 工具箱： | CAB-TDHHS-ND - CABINET ASSORT TDH + HEATSINKS CAB-HS1-ND - CABINET ASSORTMENT HEATSINK |
1-866-9-OHMITE Int’l 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info@ohmite.com
2
D Series
Heatsink For TO-252, TO-263
and TO-268 devices
Heat D i SS ip ation
THERMAL
MANAGEMENT
HEATSINK
Fea ture S
Increasedsurfaceareasby3timesthereforether-
malperformanceupto300%overthealuminum
stampedheatsinksonmarkets
Lightweightaluminumconstructionallowsfaster
pickandplaceassemblyreducingthemanufactur-
ingcycletime
Radiusmounted“Rollers”aredesignedformaxi-
mizingheattransferfromthecomponentand
avoidingthethermal“bottle-neck”seeninstamped
andstakedheatsinks.
Availableinbulkpackagingortape&reel(250
unitsperreel
RoHSCompliant
OhmiteDSeriesheatsinksprovideaninnovative
solutionforSMTcompatiblesemiconductorsand
resistors.Theuniquedesign(PatentPending)com-
binestinplated,solderablerodswithanaluminum
extrudedheatsinkbody.Theserods(or“rollers”)
arematedmechanicallytotheheatsinkbyforgingto
reducethethermalresistancebetweentheheatsink
bodyandthesolderablefeet.
Specificallydesignedforusewiththeincreasingly
popularTO-252,TO-263andTO-268packages,the
DSeriesaffordstheusersuperiorthermalperfor-
manceoverthemorecommonstampedaluminum
heatsinks.Byeliminatingthestakingjointtypically
usedinstampedheatsinks,theresultingairgapand
thermal“bottle-neck”isalsoeliminated,whilesur-
faceareaforcoolingismaximizedwiththeextruded
finsoftheDSeriesbody.
Finalthermalperformance
ishighlydependentonthe
thermalcharacteristicsof
thePCB.Itispossibletosee
a50%dropintemprisein
naturalconvectionwitha
thermallyimprovedPCB.
800
400
600
50
Heat Dissipated (watts)
40
30
25
8
4
45
35
26
10
60
14
6
4
8
10
12
200
1000
Air Velocity (ft./min.)
55
Case
Te
mp.
Rise
above
Ambient
(
C)
Thermal
Resistance
from
Mounting
Surface
to
Ambient
(
C/watts)
TO-252 (D)
TO-263 (D2)
101 & 201
301
Case
Te
mp.
Rise
above
Ambient
(
C)
Heat Dissipated (watts)
40
30
25
8
4
45
35
26
10
50
Thermal
Resistance
from
Mounting
Surface
to
Ambient
(
C/watts)
6
2
4
8
10
12
800
400
200
600
1000
Air Velocity (ft./min.)
TO-268 (D3)
101 & 201
301
D imen S ion S
0.56"
(14.2mm)
0.44"
(11.2mm)
0.27"
6.86mm
0.40"
10.16mm
0.10"
2.54mm
0.50"
12.7mm
0.56" (14.2mm)
0.44" (11.2mm)
0.27"
6.86mm
0.40"
10.16mm
0.10"
2.54mm
0.50"
12.7mm
TO-252 (D)
TO-263 (D2)
1.02"
25.91mm
TO-268 (D3)
1.22"
31.0mm
TO-252 (D)
TO-263 (D2)
0.75" (19.1mm)
0.63" (16.1mm)
TO-268 (D3)
1.58"
40.2mm
1.02"
25.91mm
0.50"
12.7mm
0.64"
16.2mm
0.76"
19.2mm
0.15"
3.7mm
0.46"
11.6mm
0.26"
6.6mm
1.02"
25.9mm
0.44"
11.1mm
0.56"
14.1mm
0.50"
12.7mm
0.48"REF
12.1mm
0.09"
2.3mm
0.26"
6.6mm
Style 10
Style 30
Style 20
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| DA-T263-101E | 制造商:Ohmite Mfg Co 功能描述:Heat Sink |
| DA-T263-101E-TR | 功能描述:散熱片 HEATSINK FOR TO-263 BLK ANODIZED RoHS:否 制造商:Ampro By ADLINK 產品:Heat Sink Accessories 安裝風格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長度: 寬度: 高度: 設計目的:Express-HRR |
| DA-T263-201E | 功能描述:散熱片 HEATSINK FOR TO-263 RoHS:否 制造商:Ampro By ADLINK 產品:Heat Sink Accessories 安裝風格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長度: 寬度: 高度: 設計目的:Express-HRR |
| DA-T263-201E-TR | 功能描述:散熱片 HEATSINK FOR TO-263 RoHS:否 制造商:Ampro By ADLINK 產品:Heat Sink Accessories 安裝風格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長度: 寬度: 高度: 設計目的:Express-HRR |
| DAT-2-637-1 | 制造商:Brady Corporation 功能描述: |
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