參數(shù)資料
型號(hào): CZRM27C56P
廠商: Comchip Technology Co., Ltd.
元件分類: 圓形連接器
英文描述: Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT02; Number of Contacts:21; Connector Shell Size:22; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle
中文描述: 表面貼裝齊納二極管
文件頁數(shù): 1/3頁
文件大小: 88K
代理商: CZRM27C56P
Weight: 0.04gram(approx.)
CZRM
27C
3V6P
THRU C200
P
NOTES : Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads ( 40um thick)
Parameter
Power Dissipation TA=25
TL=80
o
C
(
Note )
o
C
Forward voltage IF=0.2A
VALUE
0.8
2.3
1.2
300
150
100
30
180
150 / -55 to +150
Units
W
W
W
W
KW
o
C
MINI-SMA
Power Dissipation 0.8Watts
Dimensions in inches and (millimeters)
Features
Low profile surface-mount package
Zener and surge current specification
method 208 guaranteed
Polarity: cathode band
Mounting position: Any
Case: Molded plastic MINI-SMA
Epoxy: UL 94V-0 rate flame retardant
Solderable per MIL-STD-202,
Low leakage current
Excellent stability
Mechanical Data
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25
o
C
ambient temperature unless otherwise specified.
Surface Mount Zener Diode
Operating junction and Storage Temperature
Range
Thermal resistance junction to lead
ambient ( Note )
V
Non-repetitive peak pulse TJ=25
power dissipation 100us square pulse
o
C
Non-repetitive peak pulse TJ=25
power dissipation 10/1000us waveform
(
CZRM
27C7V5
P
to C100
P
)
o
C
Non-repetitive peak pulse TJ=25
power dissipation 10/1000us waveform
(
CZRM
27C110
P
to C200
P
)
o
C
0.055(1.4)
0.071(1.8)
0.161(4.1)
0.146(3.7)
0.012(0.3)Typ.
0.110(2.8)
0.094(2.4)
0.055(1.4)
0.063(1.6)
0.035(0.9)Typ.
0.035(0.9)Typ.
www.comchiptech.com
COMCHIP
MDS0310010B
Page 1
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