參數(shù)資料
型號(hào): CY7C1362B-225AC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類(lèi): DRAM
英文描述: 9-Mbit (256K x 36/512K x 18) Pipelined SRAM
中文描述: 512K X 18 CACHE SRAM, 2.8 ns, PQFP100
封裝: 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
文件頁(yè)數(shù): 29/34頁(yè)
文件大小: 895K
代理商: CY7C1362B-225AC
CY7C1360B
CY7C1362B
Document #: 38-05291 Rev. *C
Page 29 of 34
Ordering Information
ZZ Mode Timing
[26, 27]
Notes:
26.Device must be deselected when entering ZZ mode. See Cycle Descriptions table for all possible signal conditions to deselect the device.
27.DQs are in High-Z when exiting ZZ sleep mode.
Switching Waveforms
(continued)
tZZ
I
SUPPLY
CLK
ZZ
tZZREC
ALL INPUTS
(except ZZ)
DON’T CARE
IDDZZ
tZZI
tRZZI
Outputs (Q)
High-Z
DESELECT or READ Only
Speed
(MHz)
225
Ordering Code
CY7C1360B-225AC
CY7C1362B-225AC
CY7C1360B-225AI
CY7C1362B-225AI
CY7C1360B-225AJC
CY7C1362B-225AJC
CY7C1360B-225AJI
CY7C1362B-225AJI
CY7C1360B-225BGC
CY7C1362B-225BGC
CY7C1360B-225BGI
CY7C1362B-225BGI
CY7C1360B-225BZC
CY7C1362B-225BZC
CY7C1360B-225BZI
CY7C1362B-225BZI
Package
Name
A101
Part and Package Type
Operating
Range
Commercial
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
Industrial
A101
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
2 Chip Enables
Commercial
Industrial
BG119
119-ball (14 x 22 x 2.4 mm)
BGA 2 Chip Enables and
JTAG
Commercial
Industrial
BB165A
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables and JTAG
Commercial
Industrial
Shaded areas contain advance information. Please contact your local sales representative for availability of these parts.
相關(guān)PDF資料
PDF描述
CY7C1362B Plastic Connector Backshell; Enclosure Material:Plastic; Enclosure Color:Beige; Leaded Process Compatible:No; No. of Positions:26; Peak Reflow Compatible (260 C):No RoHS Compliant: No
CY7C43686AV-15AC 3.3V 1K 4K 16K x 36 x 18 x 2 Tri Bus FIFO
CY7C43686AV-7AC 3.3V 1K 4K 16K x 36 x 18 x 2 Tri Bus FIFO
CY7C43686AV-10AI 3.3V 1K 4K 16K x 36 x 18 x 2 Tri Bus FIFO
CY7C43686AV-10AC 3.3V 1K 4K 16K x 36 x 18 x 2 Tri Bus FIFO
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