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參數(shù)資料
| 型號(hào)： | CY62148-100ZSI |
| 英文描述： | x8 SRAM |
| 中文描述： | x8的SRAM |
| 文件頁(yè)數(shù)： | 3/10頁(yè) |
| 文件大小： | 153K |
| 代理商： | CY62148-100ZSI |
CY62147V18 MoBL2
3
.
Electrical Characteristics
Over the Operating Range
CY62147V18
Typ.
[2]
Parameter
Description
Test Conditions
Min.
Max.
Unit
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
I
CC
Output HIGH Voltage
I
OH
=
–
0.1 mA
I
OL
= 0.1 mA
V
CC
= 1.75V
V
CC
= 1.75V
V
CC
= 1.95V
V
CC
= 1.75V
1.5
V
Output LOW Voltage
0.2
V
Input HIGH Voltage
1.4
V
CC
+ 0.3V
0.4
V
Input LOW Voltage
–
0.5
V
μ
A
μ
A
mA
Input Load Current
GND < V
I
< V
CC
GND < V
O
< V
CC
, Output Disabled
I
OUT
= 0 mA,
f = f
MAX
= 1/t
RC
,
CMOS Levels
–
1
±1
+1
Output Leakage Current
–
1
+1
+1
V
CC
Operating Supply
Current
V
CC
= 1.95V
3
7
I
OUT
= 0 mA, f = 1 MHz,
CMOS Levels
1
2
mA
I
SB1
Automatic CE
Power-Down Current
—
CMOS Inputs
CE > V
CC
–
0.3V,
V
IN
> V
CC
–
0.3V or
V
IN
< 0.3V, f = f
MAX
CE > V
CC
–
0.3V
V
IN
> V
CC
–
0.3V
or V
IN
< 0.3V, f = 0
100
μ
A
I
SB2
Automatic CE
Power-Down Current
—
CMOS Inputs
V
CC
=
1.95V
Std.
20
50
μ
A
Capacitance
[3]
Parameter
Description
Test Conditions
Max.
Unit
C
IN
C
OUT
Input Capacitance
T
A
= 25
°
C, f = 1 MHz,
V
CC
= V
CC(typ.)
6
pF
Output Capacitance
8
pF
Thermal Resistance
Description
Test Conditions
Symbol
Θ
JA
BGA
Units
°
C/W
Thermal Resistance
(Junction to Ambient)
[3]
Still Air, soldered on a 4.25 x 1.125 inch, 4-layer printed
circuit board
55
Thermal Resistance
(Junction to Case)
[3]
Θ
JC
16
°
C/W
Note:
3.
Tested initially and after any design or process changes that may affect these parameters.
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