
CY25811/12/14
Document #: 38-07112 Rev. *D
Cypress Semiconductor Corporation, 2003. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
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Page 9 of 10
Package Drawing and Dimensions
Intel and Pentium are registered trademarks of Intel Corporation. All product and company names mentioned in this document
are the trademarks of their respective holders.
SEATING PLANE
PIN 1 ID
0.230[5.842]
0.244[6.197]
0.157[3.987]
0.150[3.810]
0.189[4.800]
0.196[4.978]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
1. DIMENSIONS IN INCHES[MM] MIN.
MAX.
0°~8°
0.016[0.406]
0.010[0.254]
X45°
2. PIN 1 ID IS OPTIONAL,
ROUND ON SINGLE LEADFRAME
RECTANGULAR ON MATRIX LEADFRAME
0.004[0.102]
1
4
5
8
3. REFERENCE JEDEC MS-012
PART #
S08.15 STANDARD PKG.
SZ08.15 LEAD FREE PKG.
4. PACKAGE WEIGHT 0.07gms
51-85066-*C
8-lead (150-Mil) SOIC S8
8
PIN 1 ID
SEATING
PLANE
1
BSC.
BSC
0°-8°
PLANE
GAUGE
2.90[0.114]
3.10[0.122]
1.10[0.043] MAX.
0.65[0.025]
0.20[0.008]
0.05[0.002]
0.15[0.006]
6.50[0.256]
0.076[0.003]
6.25[0.246]
4.50[0.177]
4.30[0.169]
0.19[0.007]
0.30[0.012]
0.09[[0.003]
0.25[0.010]
0.70[0.027]
0.50[0.020]
0.95[0.037]
0.85[0.033]
8-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z8
51-85093-*A