- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄385264 > CXG1150ER Triple Low Noise Amplifier/Dual Mixer PDF資料下載
參數(shù)資料
| 型號(hào)： | CXG1150ER |
| 英文描述： | Triple Low Noise Amplifier/Dual Mixer |
| 中文描述： | 三低噪聲放大器/雙攪拌機(jī) |
| 文件頁(yè)數(shù)： | 4/4頁(yè) |
| 文件大?。?/td> | 53K |
| 代理商： | CXG1150ER |
–
4
–
CXG1104TN
Sony Corporation
Package Outline
Unit: mm
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
PACKAGE STRUCTURE
0.22
–
0.5
5
1.2MAX
2.8 ± 0.1
10
6
2
3
0.1
0.05
–
0
0 to 10
1
A
(0.2)
0.22+ 0.08
(
0
+
DETAIL
A
0.02g
TSSOP-10P-L01
10PIN TSSOP (PLASTIC)
0.1
0.1
M
NOTE: Dimension "
" does not include mold protrusion.
0.25
+ 0.07
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
PACKAGE STRUCTURE
0.22
0.07
0.5
5
1.2MAX
2.8 ± 0.1
10
6
2
3
0.1
0.05
–
0
0
to 10
1
A
(0.2)
+ 0.07
0.22
–
(
0
–
+
DETAIL
A
0.02g
TSSOP-10P-L01
10PIN TSSOP (PLASTIC)
0.1
0.1
M
NOTE: Dimension "
" does not include mold protrusion.
0.25
–
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
COPPER ALLOY
SOLDER COMPOSITION
Sn-Bi Bi:1-4wt%
PLATING THICKNESS
5-18μm
SPEC.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CXG1156K | Power Amplifier Module for JCDMA |
| CXG1158K | Power Amplifier Module for JCDMA |
| CXK382001 | x8 ROM (Mask Programmable) |
| CXK384001 | x8 ROM (Mask Programmable) |
| CXK48324R | Field/Frame/Line Memory |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CXG1156K | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Power Amplifier Module for JCDMA |
| CXG1158K | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Power Amplifier Module for JCDMA |
| CXG1166AER | 制造商:SONY 制造商全稱:Sony Corporation 功能描述:High Power 3 x 5 Antenna Switch MMIC with Integrated Control Logic |
| CXG1166ER | 制造商:SONY 制造商全稱:Sony Corporation 功能描述:High Power 3 】 5 Antenna Switch MMIC with Integrated Control Logic |
| CXG1172UR | 制造商:SONY 制造商全稱:Sony Corporation 功能描述:JPHEMT High Power DPDT Switch with Logic Control |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。