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參數(shù)資料
| 型號： | CXG1115AER |
| 英文描述： | Dual-band Low Noise Amplifier/Mixer |
| 中文描述： | 雙波段低噪聲放大器/混頻器 |
| 文件頁數(shù)： | 4/4頁 |
| 文件大?。?/td> | 53K |
| 代理商： | CXG1115AER |
–
4
–
CXG1104TN
Sony Corporation
Package Outline
Unit: mm
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
PACKAGE STRUCTURE
0.22
–
0.5
5
1.2MAX
2.8 ± 0.1
10
6
2
3
0.1
0.05
–
0
0 to 10
1
A
(0.2)
0.22+ 0.08
(
0
+
DETAIL
A
0.02g
TSSOP-10P-L01
10PIN TSSOP (PLASTIC)
0.1
0.1
M
NOTE: Dimension "
" does not include mold protrusion.
0.25
+ 0.07
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
PACKAGE STRUCTURE
0.22
0.07
0.5
5
1.2MAX
2.8 ± 0.1
10
6
2
3
0.1
0.05
–
0
0
to 10
1
A
(0.2)
+ 0.07
0.22
–
(
0
–
+
DETAIL
A
0.02g
TSSOP-10P-L01
10PIN TSSOP (PLASTIC)
0.1
0.1
M
NOTE: Dimension "
" does not include mold protrusion.
0.25
–
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
COPPER ALLOY
SOLDER COMPOSITION
Sn-Bi Bi:1-4wt%
PLATING THICKNESS
5-18μm
SPEC.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CXG1118ER | Dual-band Low Noise Amplifier/Mixer |
| CXG1120EN | Low Noise Amplifier with Bypass Switch/Mixer |
| CXG1126EN | High Power DP3T Switch with Logic Control |
| CXG1140ER | Triple Low Noise Amplifier/Dual Mixer |
| CXG1144EN | High Power DPDT Switch with Logic Control |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CXG1115ER | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Wideband Multifunction Reception System GaAs MMIC Completely Covers GPS and CDMA |
| CXG1117K | 制造商:SONY 制造商全稱:Sony Corporation 功能描述:Power Amplifier Module for JCDMA |
| CXG1118ER | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Dual-band Low Noise Amplifier/Mixer |
| CXG1120EN | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Low Noise Amplifier with Bypass Switch/Mixer |
| CXG1121TN | 制造商:SONY 制造商全稱:Sony Corporation 功能描述:SP4T GSM/GPRS Dual-Band Antenna Switch + Logic |
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