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參數(shù)資料
| 型號： | CXD4000R |
| 英文描述： | Fingerprint Verification System LSI |
| 中文描述： | 指紋識別系統(tǒng)LSI |
| 文件頁數(shù)： | 14/14頁 |
| 文件大?。?/td> | 216K |
| 代理商： | CXD4000R |
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14
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CXD4000R
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
0.5
0.22 ± 0.05
M
0.1
DETAIL
A
DETAIL
B
0.22 ± 0.05
(0.2)
(
0
1.7 MAX
1.4 ± 0.1
B
A
120PIN LQFP (PLASTIC)
LQFP-120P-L01
LQFP120-P-1616
0.8g
1
30
31
60
61
90
91
120
0.1
S
S
S
18.0 ± 0.2
16.0 ± 0.1
(
(
0 to 10
0.1 ± 0.05
0
0.25
Package Outline
Unit: mm
Sony Corporation
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
COPPER ALLOY
SOLDER COMPOSITION
Sn-Bi Bi:1-4wt%
PLATING THICKNESS
5-18μm
SPEC.
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