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參數(shù)資料
| 型號： | CX77314 |
| 英文描述： | CX77314 Product Summary|PA Modules for GSM/GPRS Handsets |
| 中文描述： | CX77314產(chǎn)品概要|功率放大器模塊的GSM / GPRS手機 |
| 文件頁數(shù)： | 9/14頁 |
| 文件大?。?/td> | 517K |
| 代理商： | CX77314 |
PA Module for Dual-band EGSM900 DCS1800 / GPRS
Data Sheet CX77301
100956E
Skyworks Solutions, Inc. Proprietary Information
[781] 376-7000 FAX [781] 376-3100 SALES@SKYWORKSINC.COM
WWW.SKYWORKSINC.COM
9
SEPTEMBER 19, 2003
GND
EGSMIN
DCS IN
GND
GND
GND
GND
GND
GND
GND
VCC1
VCC2
EGSM OUT
DCS OUT
APC
BS
2
3
4
5
14
16
15
13
12
11
10
9
1
100956_002
6
7
8
Figure 5. CX77301 Package and Pin Configuration (Top View)
Table 4. CX77301 Pin Names and Signal Descriptions
Pin
Name
Description
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
GND
DCS IN
GND
EGSM IN
GND
VCC1
GND
VCC2
GND
EGSM OUT
GND
DCS OUT
GND
APC
GND
BS
Ground
RF input to DCS PA (DC coupled)
Ground
RF input to EGSM PA
Ground
Power supply for PA driver stages
Ground
Power supply for PA output stages
Ground
EGSM RF output (DC coupled)
Ground
DCS RF output (DC coupled)
Ground
Analog Power Control
Ground
Band select
PACKAGE AND HANDLING INFORMATION
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77301 is capable of withstanding an MSL 3/240 °C
solder reflow. Care must be taken when attaching this product,
whether it is done manually or in a production solder reflow
environment. If the part is attached in a reflow oven, the
temperature ramp rate should not exceed 5 °C per second;
maximum temperature should not exceed 240 °C. If the part is
manually attached, precaution should be taken to insure that the
part is not subjected to temperatures exceeding 240 °C for more
than 10 seconds. For details on attachment techniques,
precautions, and handling procedures recommended by
Skyworks, please refer to Application Note: PCB Design and SMT
Assembly/Rework, Document Number 101752 Additional
information on standard SMT reflow profiles can also be found in
the JEDEC Standard J–STD–020B
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Application
Note: Tape and Reel, Document Number 101568.
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