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參數(shù)資料
| 型號(hào)： | CX77144 |
| 英文描述： | CX77144 Product Summary|PA Modules for CDMA Handsets |
| 中文描述： | CX77144產(chǎn)品概要|功率放大器模塊的CDMA手機(jī) |
| 文件頁(yè)數(shù)： | 13/16頁(yè) |
| 文件大小： | 246K |
| 代理商： | CX77144 |
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CX77129
Package Dimensions & Pin Descriptions
System Smart PA Module for CDMA / AMPS (824–849 MHz)
101384A
May 14, 2002
Conexant
13
Package Dimensions & Pin Descriptions
Figure 13
shows the bottom view of the CX77129 package outline with the solder pads clearly
visible.
Table 6
lists the CX77129 signal descriptions.
Figure 13. CX77129 Package Drawing
Table 6. Signal Description
Pin
Name
Description
1
VCC1
Supply for High-Power Amplifier. Must be decoupled close to package
2
RF IN
50
RF Input—DC decoupled internally inside module
3
VREF
Power Range logic (Analog voltage, NOT CMOS COMPATIBLE). See
Table 3
for logic
states
4
VCONT1
Power Range logic (Digital Voltage, CMOS COMPATIBLE). See
Table 3
for logic states
5
VCONT2
Supply for High-Power Amplifier. Must be decoupled close to package
6
RF OUT
50
RF Output—DC decoupled internally inside module
7
GND
GND for Logic Circuits
8
VCONT2
Power Range logic (Digital Voltage, CMOS COMPATIBLE). See
Table 3
for logic states
9
(Pkg
Base)
GND2
Backside of package must be solder-connected directly to a ground plane by multiple
VIA’s
101384_002
3.20
1.40
3.06
1.41
TYP
GND
RF OUT
VCC2
VCC1
RF IN
VREF
VCONT1
TOP VIEW
VCONT2
1
2
3
7
6
5
8
4
GROUND
PAD
1.50
6.00
SIDE VIEW
Note:
Solder mask pattern pad layout as
seen from top looking through package.
0.90
0.76
R0.20
PAD
DETAIL
All dimensions in millimeters.
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