
Power Amplifier Driver
CX65001
101466C
September 20, 2002
Skyworks – Preliminary
5
Proprietary Information and Specifications Are Subject to Change
Evaluation Board Description
The CX65001 Evaluation Board is used to test the CX65001
power amplifiers performance. The CX65001 Evaluation Board
schematic diagramis shown in Figure 12. The schematic shows
the basic design of the board for the 375 to 475 MHz range. The
Evaluation Board assembly diagramis shown in Figure 13 and
the Evaluation Board layer detail is shown in Figure 14.
Figure 15 provides the mounting footprint for the CX65001.
Circuit Design Configurations ________________________
The following design considerations need to be followed
regardless of final use or configuration:
1. Paths to ground should be made as short as possible.
2. The ground pad of the CX65001 power amplifier has
special electrical and thermal grounding requirements. This
pad is the main thermal conduit for heat dissipation. Since
the circuit board acts as the heat sink, it must shunt as
much heat as possible fromthe amplifier. As such, design
the connection to the ground pad to dissipate the maximum
wattage produced to the circuit board. Multiple vias to the
grounding layer are required (see Figures 14 and 15).
Note: Junction temperature (T
J
) of the device increases with a
poor connection to the slug and ground. This reduces
the lifetime of the device.
3. Five external bypass capacitors, a 1
μ
F and four 100 pF
capacitors, are required on the Vcc line and on pin 4, pin 5,
and pin 8. Capacitors C7 (100 pF) and C8 (1
μ
F) are
placed in parallel between the supply line and ground, C4
(100 pF) is placed between pin 4 and ground, C5 (100 pF)
is placed between pin 8 and ground, and C6 (100 pF) is
placed between pin 5 and ground.
4. A bias resistor, R1 (270
), is used to control Vcc1
(reference voltage of the bias circuit) at pin 8. The nomnal
total current with a 270
bias resistor is 125 mA with Vcc1
and Vcc2 equal to 5 V. Inductor L3 (39 nH) is placed
between the RF output transmssion line and Vcc supply
voltage line.
5. Inductor L2 (27 nH) is placed between pin 4 (bias circuit
output) and pin 2 (base of RF transistor) for bias circuit and
RF transistor connection.
6. Inductor L1 (15 nH), and capacitors C1 (12 pF) and C2
(15 pF) are the input matching components and capacitor
C10 (56 pF) is the output matching component. Use a short
transmssion line (about 100 mls) between the RF input pin
(pin 3) and RF input matching components (C1, C2, and
L1). Also use a short output transmssion line (about
100 mls) between the RF output pins (pin 6 and pin 7) and
the RF output matching component (C10).
Testing Procedure___________________________________
Use the following procedure to set up the CX65001 Evaluation
Board for testing, Refer to Figure 16 for guidance:
1. Connect a 5.0 V supply to Vcc. If available, enable the
current limting function of the power supply to 240 mA.
2. Connect a signal generator to the RF signal input port. Set
it to the desired RF frequency at a power level of –15 dBm
or less to the Evaluation Board but do NOT enable the RF
signal.
3. Connect a spectrumanalyzer to the RF signal output port.
4. Enable the power supply.
5. Enable the RF signal and take measurements.
Caution:
If any of the input signals exceed the rated maximum
values, the CX65001 Evaluation Board can be
permanently damaged.