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| 型號： | CSPST16-560J |
| 廠商： | California Micro Devices Corporation |
| 英文描述： | CHIP SCALE SERIES TERMINATION ARRAY |
| 中文描述： | 芯片級系列終止陣列 |
| 文件頁數(shù)： | 1/4頁 |
| 文件大?。?/td> | 52K |
| 代理商： | CSPST16-560J |
2000 California Micro Devices Corp. All rights reserved.
11/10/2000
1
CSPST
CALIFORNIA MICRO DEVICES
215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
Chip Scale Series Termination Array
Features
8 or 16 integrated high frequency series
terminations
Ultra small footprint Chip Scale Package
Ceramic substrate
0.35mm Eutectic Solder Bumps, 0.65mm pitch
Product Description
The CSPST is a high performance Integrated Passive
Device (IPD) which provides series terminations suitable
for use in high speed bus applications. Eight (8) or
sixteen (16) series termination versions are provided.
These resistors provide excellent high frequency
performance in excess of 3GHz and are manufactured to
an absolute tolerance as low as ±1%. The Chip Scale
Applications
Series resistive bus termination
Isolated resistor array
C1300700
SCHEMATIC DIAGRAMS
Package provides an ultra small footprint for this IPD
and provides minimal parasitics compared to conven-
tional packaging. Typical bump inductance is less than
25pH. The large solder bumps and ceramic substrate
allow for standard attachment to laminate printed circuit
boards without the use of underfill.
CSPST08
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