
2000 California Micro Devices Corp. All rights reserved.
9/26/2000
1
CSPRC032
CALIFORNIA MICRO DEVICES
215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
Chip Scale Package (CSP) EMI Filter Network
Features
Minimal Cross-Talk
4 Filter lines per device
Ultra small foot print
Silicon substrate
0.35mm Eutectic Solder Bumps
Product Description
Many portable applications frequently demand filtering
of signals in the 800-2,700 MHz band. California Micro
Devices’ unique thin film Flip Chip filters provide a
minimum of –30 dB of attenuation over this frequency
band. The bump size and pitch of these filters are
selected such that the device can be placed directly on
a FR4 printed circuit board using conventional assembly
Applications
Cellular Phones
Cordless Phones
Internet Appliances
PDAs
Laptop Computers
C1450800
SCHEMATIC DIAGRAM
techniques. The pin-out for the device features a signal
‘flow through’ design, allowing optimal signal routing.
Ground-bounce and cross-talk are minimized via a die
design that provides two solder bump contacts to the
common supply connection. The solder bump contacts
are a 63/37 Sn/Pb alloy and are nominally 0.35 mm in
diameter.
R 50
R 50
C
43pF
GND
A1
B1
GND
B3
R 50
R 50
C
43pF
GND
A2
B2
R 50
R 50
C
43pF
GND
A4
B4
R 50
R 50
C
43pF
GND
A5
B5
* Note 1: Calculated with 0
Source impedance and infinite Load
impedance.
* Note 2: Calculated with 50
Source impedance and 50
Load
impedance.
S
E
0
1
3
2
1
4
1
5
U
5
±
4
±
±
–
<
2
L
A
V
D
R
A
D
N
A
T
S
r
o
e
e
s
b
o
a
p
a
C
e
s
b
A
R
C
T
r
e
p
O
k
a
e
L
e
w
o
P
R
A
R
e
c
n
a
r
e
T
r
e
T
o
e
R
T
g
n
C
e
g
a
n
R
r
%
F
%
0
°
A
W
m
0
p
0
0
0
μ
C
e
c
n
a
s
p
t
e
R
r
f
m
t
p
p
C
e
g
n
a
R
e
6
r
r
u
r
@
o
e
e
m
e
r
u
/
C
°
5
8
o
V
±
S
(
F
C
I
S
I
R
E
T
C
A
R
A
H
C
)
F
p
(
C
(
F
3
4
L
A
C
I
R
T
C
(
0
5
E
R
)
L
E
r
e
R
)
z
e
o
N
M
4
7
)
z
e
o
N
M
4
7
C
H
H