參數(shù)資料
型號(hào): CS8481YDP5
元件分類: 基準(zhǔn)電壓源/電流源
英文描述: THREE-TERMINAL POSITIVE FIXED VOLTAGE REGULATORS
中文描述: 三端固定電壓調(diào)節(jié)器
文件頁(yè)數(shù): 5/8頁(yè)
文件大小: 61K
代理商: CS8481YDP5
CS8481
http://onsemi.com
5
ENABLE
The ENABLE function controls V
OUT1
. When ENABLE
is high, V
OUT1
is on. When ENABLE is low, V
OUT1
is off.
Calculating Power Dissipation in a
Dual Output Linear Regulator
The maximum power dissipation for a dual output
regulator (Figure 3) is
PD(max)
VIN(max)
VIN(max)
VOUT1(min)IOUT1(max)
VOUT2(min)IOUT2(max)
VIN(max)IQ
(1)
where:
V
IN(max)
is the maximum input voltage,
V
OUT1(min)
is the minimum output voltage from V
OUT1
,
V
OUT2(min)
is the minimum output voltage from V
OUT2
,
I
OUT1(max)
is the maximum output current, for the
application,
I
OUT2(max)
is the maximum output current, for the
application, and
I
Q
is the quiescent current the regulator consumes at both
I
OUT1(max)
and I
OUT2(max)
.
Once the value of P
D(max)
is known, the maximum
permissible value of R
Θ
JA
can be calculated:
R JA
150
°
C
TA
PD
(2)
The value of R
Θ
JA
can be compared with those in the
package section of the data sheet. Those packages with
R
Θ
JA
’s less than the calculated value in equation 2 will keep
the die temperature below 150
°
C.
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
Figure 3. Dual Output Regulator With Key
Performance Parameters Labeled.
SMART
REGULATOR
Control
Features
V
OUT1
I
OUT1
V
OUT2
I
OUT2
V
IN
I
IN
I
Q
Heat Sinks
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of R
Θ
JA
:
R JA
R JC
R CS
R SA
(3)
where:
R
Θ
JC
= the junction–to–case thermal resistance,
R
Θ
CS
= the case–to–heatsink thermal resistance, and
R
Θ
SA
= the heatsink–to–ambient thermal resistance.
R
Θ
JC
appears in the package section of the data sheet. Like
R
Θ
JA
, it too is a function of package type. R
Θ
CS
and R
Θ
SA
are functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.
Figure 4. Test & Application Circuit
* C
1
required if regulator is located far from power supply filter.
** C
2
and C
3
required for stability. Capacitor must operate at minimum temperature expected during system operations.
ENABLE
V
OUT2
V
IN
V
OUT1
CS8281
GND
Load
V
BATT
V
CC
I/O
GND
P
C
3
**
C
1
*
C
2
**
0.1
μ
F
22
μ
F
ESR < 8
22
μ
F
ESR < 8
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