參數(shù)資料
型號(hào): CS5203A-5GT3
元件分類: 基準(zhǔn)電壓源/電流源
英文描述: THREE-TERMINAL POSITIVE FIXED VOLTAGE REGULATORS
中文描述: 三端固定電壓調(diào)節(jié)器
文件頁數(shù): 7/12頁
文件大?。?/td> 88K
代理商: CS5203A-5GT3
CS5203A–1, CS5203A–2, CS5203A–3, CS5203A–5
http://onsemi.com
7
Calculating Power Dissipation and Heat Sink
Requirements
The CS5203A series of linear regulators includes thermal
shutdown and current limit circuitry to protect the device.
High power regulators such as these usually operate at high
junction temperatures so it is important to calculate the
power dissipation and junction temperatures accurately to
ensure that an adequate heat sink is used.
The case is connected to V
OUT
on the CS5203A, electrical
isolation may be required for some applications. Thermal
compound should always be used with high current
regulators such as these.
The thermal characteristics of an IC depend on the
following four factors:
1.
2.
3.
4.
Maximum Ambient Temperature T
A
(
°
C)
Power dissipation P
D
(Watts)
Maximum junction temperature T
J
(
°
C)
Thermal resistance junction to ambient R
Θ
JA
(
°
C/W)
These four are related by the equation
TJ
TA
PD
R JA
(1)
The maximum ambient temperature and the power
dissipation are determined by the design while the
maximum junction temperature and the thermal resistance
depend on the manufacturer and the package type.
The maximum power dissipation for a regulator is:
PD(max)
{VIN(max)
VOUT(min)}IOUT(max)
VIN(max)IQ
(2)
where:
V
IN(max)
is the maximum input voltage,
V
OUT(min)
is the minimum output voltage,
I
OUT(max)
is the maximum output current, for the
application
I
Q
is the maximum quiescent current at I
OUT(max)
.
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment has a thermal resistance. Like series
electrical resistances, these resistances are summed to
determine R
Θ
JA
, the total thermal resistance between the
junction and the surrounding air.
1.
Thermal Resistance of the junction to case, R
Θ
JC
(
°
C/W)
2.
Thermal Resistance of the case to Heat Sink, R
Θ
CS
(
°
C/W)
3.
Thermal Resistance of the Heat Sink to the ambient
air, R
Θ
SA
(
°
C/W)
These are connected by the equation:
R JA
R JC
R CS
R SA
(3)
The value for R
Θ
JA
is calculated using equation (3) and
the result can be substituted in equation (1).
The value for R
Θ
JC
is normally quoted as a single figure
for a given package type based on an average die size. For
a high current regulator such as the CS5203A the majority
of the heat is generated in the power transistor section. The
value for R
Θ
SA
depends on the heat sink type, while R
Θ
CS
depends on factors such as package type, heat sink interface
(is an insulator and thermal grease used), and the contact
area between the heat sink and the package. Once these
calculations are complete, the maximum permissible value
of R
Θ
JA
can be calculated and the proper heat sink selected.
For further discussion on heat sink selection, see application
note “Thermal Management for Linear Regulators,”
document number SR006AN/D, available through the
Literature Distribution Center or via our website at
http://onsemi.com.
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