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參數(shù)資料
| 型號(hào)： | CS5132GDW24 |
| 廠商： | ZF Electronics Corporation |
| 英文描述： | Dual Output CPU Buck Controller |
| 中文描述： | CPU的雙輸出降壓控制器 |
| 文件頁數(shù)： | 17/19頁 |
| 文件大?。?/td> | 238K |
| 代理商： | CS5132GDW24 |
Application Information: continued
Therefore, the range of load currents that will cause the
internal current sense comparator to detect an overload
condition through a 3.3m embedded PCB trace is: 19.3A
< I
CL
< 38.7A, with 26A being the nominal overload condi-
tion.
Design Rules for Using a Droop Resistor
The basic equation for laying an embedded resistor is:
R
AR
=
r ′
or R =
r ′
,
where
A= W
′
t = cross-sectional area;
r
= the copper resistivity (μ-mil);
L= length (mils);
W = width (mils);
t = thickness (mils).
For most PCBs the copper thickness, t, is 35μm (1.37 mils)
for one ounce copper;
r
= 717.86μ-mil.
For a CPU load of 16A the resistance needed to create a
50mV drop at full load is:
R
DROOP
=
=
= 3.1m.
The resistivity of the copper will drift with the temperature
according to the following guidelines:
R = 12% @ T
A
= +50C;
R = 34% @T
A
= +100C.
Droop Resistor Length, Width, and Thickness
The minimum width and thickness of the droop resistor
should primarily be determined on the basis of the current-
carrying capacity required, and the maximum permissible
droop resistor temperature rise. PCB manufacturer design
charts can be used in determining current- carrying capaci-
ty and sizes of etched copper conductors for various tem-
perature rises above ambient.
For single conductor applications, such as the use of the
droop resistor, PCB design charts show that for a droop
resistor with a required current-carrying capacity of 16A,
and a 45C temperature rise above ambient, the recom-
mended cross section is 275 mil
2
.
W
′
t = 275 mil
2
,
where
W = droop resistor width;
t = droop resistor thickness.
For 1oz. copper, t= 1.37 mils, therefore W = 201 mils =
0.201 in.
R =
r ′
,
where
R = droop resistor value;
r
= 0.71786m
W
-mil (1 oz. copper);
L = droop resistor length;
W = droop resistor width.
R
DROOP
= 3.3m
W.
3.3m
W
= 0.71786m
W
-mil
′
.
Hence, L = 1265 mils = 1.265 in.
In layouts where it is impractical to lay out a droop resistor
in a straight line 1265 mils long, the embedded PCB trace
can be òsnakedó to fit within the available space.
Thermal Considerations for Power MOSFETs and Diodes
In order to maintain good reliability, the junction tempera-
ture of the semiconductor components should be kept to a
maximum of 150C or lower. The thermal impedance
(junction to ambient) required to meet this requirement can
be calculated as follows:
Thermal Impedance =
.
A heatsink may be added to TO-220 components to reduce
their thermal impedance. A number of PC board layout
techniques such as thermal vias and additional copper foil
area can be used to improve the power handling capability
of surface mount components.
As a consequence of large currents being turned on and off
at high frequency, switching regulators generate noise as a
consequence of their normal operation. When designing
for compliance with EMI/EMC regulations, additional
components may be added to reduce noise emissions.
These components are not required for regulator operation
and experimental results may allow them to be eliminated.
The input filter inductor may not be required because bulk
filter and bypass capacitors, as well as other loads located
on the board will tend to reduce regulator di/dt effects on
the circuit board and input power supply. Placement of the
power component to minimize routing distance will also
help to reduce emissions.
EMI Management
T
J(MAX)
- T
A
Power
Thermal Management
L
201 mils
′
1.37 mils
L
W
′
t
50mV
16A
50mV
I
OUT
L
(W
′
t)
L
A
17
C
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