參數(shù)資料
型號: CS3717AGNF16
廠商: ZF Electronics Corporation
元件分類: 基準電壓源/電流源
英文描述: 1A H-Bridge Stepper Motor Driver
中文描述: 第1A H橋步進電機驅(qū)動器
文件頁數(shù): 7/8頁
文件大小: 168K
代理商: CS3717AGNF16
7
Application Circuit - Two Phase Bipolar Stepper Motor Driver
1
W
R
Sense
V
S
1k
W
R
C
C
C
0.1
m
F
CS-3717A
C2
C1 100
m
F
820pF
1k
W
R
C
1
W
R
Sense
C
C
820pF
C
T
820pF
C
T
820pF
Comp In
Gnd
IN0
V
REF
56k
W
R
T
56k
W
R
T
CS3717A
I
MA
I
MB
MBA
MAA
STEPPER
MOTOR
V
SS
0.1
m
F C3
FROM
m
PROCESSOR
Gnd
Sense
Out B
OutA
V
DDA
V
DDB
V
CC
IN1
DIRECTION
Pulse
V
CC
V
REF
IN1
Sense
Gnd
Pulse
DIRECTION
IN0
V
DDA
OUTA
OUTB
V
DDB
Gnd
COMP IN
C
The R
Q
JA
of the CS3717A can be reduced by soldering the
Gnd pins to a suitable copper area of the printed circuit
board or to an external heatsink.
The diagram of fig. 2 shows the maximum dissipated
power P
tot
and the R
Q
JA
as a function of the side ò
l
ó of
two equal square copper areas having a thickness of 35μ
(see fig. 1). In addition, it is possible to use an external
heatsink (see fig. 3). During soldering the pins temperature
must not exceed 260C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area must
be connected to electrical ground.
Mounting Instructions
Figure 2 - Max. Power Dissipation And Junction To Ambient Thermal
Resistance vs. Size òl(fā)ó for 16 lead fused package.
1
2
3
4
P
tot
(W)
10
20
30
40
I(mm)
00
20
40
60
80
(C/W)
0
òl(fā)ó
P
tot
(T
amb
= 70C)
R
q
JA
R
q
JA
l
l
COPPER AREA 35
m
THICKNESS
P.C. BOARD
Figure 1 - Example of P.C. Board Copper Area Which is Used as
Heatsink with 16 lead fused package.
170mm
38.0mm
11.9mm
050
1
2
3
4
5
P
tot
(W)
0
50
100
Tamb (C)
FREE AIR
HEAT-SNKWTHR
th
=25CW
Figure 3 - External Heatsink Mounting Example (R
th
= 30C/W) for 16
lead batwing package.
Figure 4 - Maximum Allowable Power Dissipation vs. Ambient
Temperature for 16 lead batwing package.
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