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參數(shù)資料
| 型號(hào)： | CS1V470MR |
| 廠商： | DB Lectro Inc. |
| 英文描述： | LAMP,14,INCANDESCENT G-3-1/2,2.47V,.300A,.50MSCP |
| 中文描述： | 芯片類(lèi)型，標(biāo)準(zhǔn) |
| 文件頁(yè)數(shù)： | 10/13頁(yè) |
| 文件大?。?/td> | 445K |
| 代理商： | CS1V470MR |
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LEAD FREE REFLOW SOLDERING CONDITION
(Applicable to Chip Type Aluminum Electrolytic Capacitors)
Recommended Conditions for Reflow Soldering
(1) A thermal condition system such as infrared radiation (IR) or hot blast should be adopted, and
vapor heat transfer systems (VPS) are not recommended.
(2) Reflow soldering should be performed one time. If the capacitor has to be reflowed twice, 30
minutes must be layout between each time.
(3) For lead-free type reflow soldering, please observe proper conditions below:
a) The time of preheating from 150°C to 200°C shall be within maximum 180 seconds;
b) The time of soldering temperature at 217°C measured on capacitors' top shall not exceed
tL (second);
c) The peak temperature on capacitors' top shall not exceed Tp(°C), and the time within 5°C
of actual peak temperature shall not exceed tp (second).
Classification Reflow Profile
*1. Average ramp-up rate is 3
/second max.
*2. Ramp-down rate is 6
/second max.
*3. Time from 25
to peak temperature is 8 minutes max.
tp
200
25
217
Tp
150
t
L
25
¤
to Peak *3
Ramp-down
Ramp-up
*1
*2
Preheat 180 sec Max
Time
T
Critical Zone
217 to Tp
Allowable Range of Peak Temperature
Size
Thickness (mm)
Volume (mm
3
)
Tp(°C)
t
L
(second)
tp (second)
4~
6.3,
8
u
6.2L
t
2.5
<350
250±0
90
5
8
u
10.5L
t
2.5
350~2000
240±0
90
5
10
u
10.5L/13.5L
t
2.5
350~2000
235±0
60
5
12.5,
16
t
2.5
>2000
230±0
30 (20*)
5
Re:
(20*) is special for mid-to-high voltage which is HU series.
Recommended Land Size (Unit: mm)
Size
a
b
c
4
1.6
2.6
1.6
5
1.6
3.0
1.6
6.3
1.6
3.5
1.6
8×6.2L
2.1
4.5
1.6
8×10.5L
3.0
3.5
2.5
10
4.0
4.0
2.5
12.5
4.0
5.7
3.0
16×16.5/21.5
6.0
6.5
3.5
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|---|---|
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