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參數(shù)資料
| 型號(hào)： | CS1V221LR |
| 廠商： | DB Lectro Inc. |
| 英文描述： | CHIP TYPE, STANDARD |
| 中文描述： | 芯片類(lèi)型，標(biāo)準(zhǔn) |
| 文件頁(yè)數(shù)： | 4/13頁(yè) |
| 文件大?。?/td> | 445K |
| 代理商： | CS1V221LR |
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CORRESPONDING TO RoHS DIRECTIVE
Aluminum electrolytic
capacitors
Chip type
Radial lead type
Snap-in type
RoHS compliant
Yes
Yes
Yes
RoHS
restricted
substances
Most concerns
on terminals
Plating on
terminals
Change plating from Sn-Pb to
Sn
Change plating from Sn-Pb to
Sn
Change plating from Sn-Pb to
Sn
Construction of
terminals
Fe/Cu/Sn
Fe/Cu/Sn
Fe/Cu/Sn
Plating
characters
Plating thickness 12
P
m
Plating type matte
No heat treatment after plating
Plating thickness 12
P
m
Plating type matte
No heat treatment after plating
Plating thickness 10
P
m
Plating type matte
No heat treatment after plating
Insulating
sleeve
No used
Replace PVC with PET
(where customer designated)
Replace PVC with PET
(where customer designated)
Resistance to
soldering heat
Please see "Lead Free Reflow
Soldering Condition" for chip
type aluminum electrolytic
capacitors
No change
No change
Solderability
No difference with Sn-Pb
No difference with Sn-Pb
No difference with Sn-Pb
Tensile strength
No difference with Sn-Pb
No difference with Sn-Pb
No difference with Sn-Pb
Pb
Whisker
No difference with Sn-Pb
Room storage test: 20~25
q
C,
30~80%RH, 4000hrs.
Aging test: 60
r
5
q
C, 93
+2/-3%RH, 4000hrs.
Thermal cycle test: -55
+0/-10
q
C to 85 +10/-0
q
C, 3
cycles/hour, 1000 cycles
No difference with Sn-Pb
Room storage test: 20~25
q
C,
30~80%RH, 4000hrs.
Aging test: 60
r
5
q
C, 93
+2/-3%RH, 4000hrs.
Thermal cycle test: -55
+0/-10
q
C to 85 +10/-0
q
C, 3
cycles/hour, 1000 cycles
Whisker is not observed
Room storage test: 20~25
q
C,
30~80%RH, 4000hrs.
Aging test: 60
r
5
q
C, 93
+2/-3%RH, 4000hrs.
Thermal cycle test: -55
+0/-10
q
C to 85 +10/-0
q
C, 3
cycles/hour, 1000 cycles
Cr
6+
Plating material
< 2ppm
< 2ppm
< 2ppm
Hg
< 2ppm
< 2ppm
< 2ppm
Cd
< 2ppm
< 2ppm
< 2ppm
PBB
Not detected
Not detected
Not detected
PBDE
Not detected
Not detected
Not detected
Identification for RoHS
compliance products
Add "Pb free" or "RoHS"
marking on inner and outer
carton label (where customer
designated)
Add "Pb free" or "RoHS"
marking on inner and outer
carton label (where customer
designated)
Add "Pb free" or "RoHS"
marking on inner and outer
carton label (where customer
designated)
MSL Level
(IPC/JEDEC J-STD-020C)
Not available
No need for dry package
Not available
No need for dry package
Not available
No need for dry package
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CS1V221LT | CHIP TYPE, STANDARD |
| CS1V221MC | CHIP TYPE, STANDARD |
| CS1V221MR | CHIP TYPE, STANDARD |
| CS1V221MT | CHIP TYPE, STANDARD |
| CS1V330KC | CHIP TYPE, STANDARD |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CS1V221LT | 制造商:DBLECTRO 制造商全稱(chēng):DB Lectro Inc 功能描述:CHIP TYPE, STANDARD |
| CS1V221MC | 制造商:DBLECTRO 制造商全稱(chēng):DB Lectro Inc 功能描述:CHIP TYPE, STANDARD |
| CS1V221MR | 制造商:DBLECTRO 制造商全稱(chēng):DB Lectro Inc 功能描述:CHIP TYPE, STANDARD |
| CS1V221MT | 制造商:DBLECTRO 制造商全稱(chēng):DB Lectro Inc 功能描述:CHIP TYPE, STANDARD |
| CS1V330KC | 制造商:DBLECTRO 制造商全稱(chēng):DB Lectro Inc 功能描述:CHIP TYPE, STANDARD |
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