參數(shù)資料
型號: CRG03
廠商: Toshiba Corporation
英文描述: Zener Diode; Application: General; Pd (mW): 400; Vz (V): 1.7 to 1.9; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MHD
中文描述: 通用整流器應(yīng)用
文件頁數(shù): 1/4頁
文件大?。?/td> 171K
代理商: CRG03
CRG03
2006-11-06
1
TOSHIBA Rectifier Silicon Diffused Type
CRG03
General Purpose Rectifier Applications
Average forward current: I
F (AV)
= 1.0 A
Repetitive peak reverse voltage: V
RRM
= 400 V
Suitable for compact assembly due to small surface-mount package
“S
FLAT
TM
” (Toshiba package name)
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristics
Symbol
Rating
Unit
Repetitive Peak Reverse Voltage
V
RRM
400
V
Average Forward Current
I
F (AV)
1.0
Note
A
Peak One Cycle Surge Forward
Current (Non
Repetitive)
I
FSM
15.0 (50Hz)
16.5 (60Hz)
A
Junction Temperature
T
j
40~150
°C
Storage Temperature Range
T
stg
40~150
°C
Note: 1 Ta
=
56°C
Device mounted on a ceramic board
board size: 50 mm
×
50 mm
soldering land: 2 mm
×
2 mm
board thickness 0.64t
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics
(Ta
=
25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
V
FM(1)
I
FM
= 0.1 A (Pulse test)
0.86
V
V
FM(2)
I
FM
= 0.7 A (Pulse test)
0.97
1.1
V
Peak forward voltage
V
FM(3)
I
FM
= 1.0 A (Pulse test)
1.0
V
Repetitive peak reverse current
I
RRM
V
RRM
= 400 V (Pulse test)
10
μ
A
Device mounted on a ceramic board
Board size: 50 mm
×
50 mm
Soldering land: 2 mm
×
2 mm
Board thickness: 0.64t
65
R
th (j-a)
Device mounted on a glass-epoxy
board
Board size: 50 mm
×
50 mm
Soldering land: 6 mm
×
6 mm
Board thickness: 1.6t
130
°C/W
Thermal resistance
R
th (j-
)
20
°C/W
Unit: mm
JEDEC
JEITA
TOSHIBA
3-2A1A
Weight: 0.013 g (typ.)
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