參數(shù)資料
型號: CPC7594MC
廠商: CLARE INC
元件分類: 通信及網(wǎng)絡(luò)
中文描述: SPECIALTY TELECOM CIRCUIT, PDSO16
封裝: ROHS COMPLIANT, DFN-16
文件頁數(shù): 11/20頁
文件大?。?/td> 596K
代理商: CPC7594MC
CPC7594
R03
www.clare.com
19
3.2 Printed-Circuit Board Layout
3.2.1 DFN
NOTE: As the metallic pad on the bottom of the DFN
package is connected to the substrate of the die, Clare
recommends that no printed circuit board traces or
vias be placed under this area to maintain minimum
creepage and clearance values.
3.2.2 SOIC
3.3 Tape and Reel Packaging
3.3.1 DFN
DIMENSIONS
mm
(inches)
5.80
(0.228)
0.35
(0.014)
1.05
(0.041)
0.80
(0.031)
2.00
(0.079)
1.27
(0.050)
mm
(inches)
DIMENSIONS
9.40
(0.370)
0.60
(0.024)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Dimensions
mm
(inches)
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
K
0=1.61 + 0.10
(0.063 + 0.004)
B
0=7.24 + 0.10
(0.285 + 0.004)
W=16.00 + 0.30
(0.630 + 0.012)
P=12.00 + 0.10
(0.472 + 0.004)
A
0=6.24 + 0.10
(0.246 + 0.004)
Pin 1
User Direction of Feed
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