參數(shù)資料
型號: CPC5611A
元件分類: 通信、網(wǎng)絡(luò)模塊及開發(fā)工具
英文描述: Telecomm/Datacomm
中文描述: 電信/數(shù)據(jù)通信
文件頁數(shù): 18/18頁
文件大?。?/td> 410K
代理商: CPC5611A
7.2 Tape and Reel Packaging
Figure 19. Tape and Reel Dimensions
7.3 Soldering
7.3.1 Moisture Reflow Sensitivity
Clare has characterized the moisture reflow sensitivity
of LITELINK using IPC/JEDEC standard J-STD-020A.
Moisture uptake from atmospheric humidity occurs by
diffusion. During the solder reflow process, in which
the component is attached to the PCB, the whole body
of the component is exposed to high process tempera-
tures. The combination of moisture uptake and high
reflow soldering temperatures may lead to moisture
induced delamination and cracking of the component.
To prevent this, this component must be handled in
accordance with IPC/JEDEC standard J-STD-020A
per the labeled moisture sensitivity level (MSL), level
6.
7.3.2 Reflow Profile
The maximum ramp rates, dwell times, and tempera-
tures of the assembly reflow profile should not exceed
those specified in IPC/JEDEC standard J-STD-020A,
which were used to determine the moisture sensitivity
level of this component.
7.4 Washing
Clare does not recommend ultrasonic cleaning of this
part.
Dimensions
mm
(inches)
330.2 DIA.
(13.00)
Top Cover
Tape Thickness
.102 MAX.
(.004)
12.090
(.476)
Embossed Carrier
Embossment
6.731 MAX.
(.265)
.406 MAX.
(.016)
Top Cover
Tape
3.20
(.126)
2.70
(.106)
7.493 ± .102
(.295 ± .004)
1.753 ± .102
(.069 ± .004)
2.007 ± .102
(.079 ± .004)
1.498 ±.102
(.059 ± .004)
3.987 ± .102
(.157 ±.004)
Feed Direction
11.989 ± .102
(.472 ± .004)
10.897 ± .025
(.429 ± .001)
1.549 ± .102
(.061 ± .004)
10.693 ± .025
(.421 ± .001)
16.002 ± .305
(.630 ± .012)
.050R TYP.
www.clare.com
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