
CMT01N60
P
OWER
F
IELD
E
FFECT
T
RANSISTOR
2005/12/05
Rev. 1.5
Champion Microelectronic Corporation
Page 2
ORDERING INFORMATION
Part Number
CMT01N60N251
CMT01N60N252
CMT01N60N92
CMT01N60GN251*
CMT01N60GN252*
CMT01N60GN92*
*Note:
G : Suffix for Pb Free Product
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, T
J
= 25
℃
.
Package
TO-251
TO-252
TO-92
TO-251
TO-252
TO-92
CMT01N60
Typ
Characteristic
Symbol
V
(BR)DSS
Min
600
Max
Units
V
Drain-Source Breakdown Voltage
(V
GS
= 0 V, I
D
= 250
μ
A)
Drain-Source Leakage Current
(V
DS
= 600 V, V
GS
= 0 V)
(V
DS
= 480 V, V
GS
= 0 V, T
J
= 125
℃
)
Gate-Source Leakage Current-Forward
(V
gsf
= 20 V, V
DS
= 0 V)
Gate-Source Leakage Current-Reverse
(V
gsr
= 20 V, V
DS
= 0 V)
Gate Threshold Voltage
(V
DS
= V
GS
, I
D
= 250
μ
A)
Static Drain-Source On-Resistance (V
GS
= 10 V, I
D
= 0.6A) *
Forward Transconductance (V
DS
≧
50 V, I
D
= 0.5A) *
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Internal Drain Inductance
(Measured from the drain lead 0.25” from package to center of die)
Internal Drain Inductance
(Measured from the source lead 0.25” from package to source bond pad)
SOURCE-DRAIN DIODE CHARACTERISTICS
Forward On-Voltage(1)
Forward Turn-On Time
Reverse Recovery Time
I
DSS
0.1
0.3
100
mA
I
GSSF
nA
I
GSSR
100
nA
V
GS(th)
2.0
4.0
V
R
DS(on)
g
FS
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
L
D
8.0
14
0.5
mhos
pF
pF
pF
210
28
4.2
8
21
18
24
8.5
1.8
4
4.5
(V
DS
= 25 V, V
GS
= 0 V,
f = 1.0 MHz)
ns
ns
ns
ns
(V
DD
= 300 V, I
D
= 1.0 A,
V
GS
= 10 V,
R
G
= 18
) *
nC
nC
nC
(V
DS
= 400 V, I
D
= 1.0 A,
V
GS
= 10 V)*
nH
L
S
7.5
nH
V
SD
t
on
t
rr
1.5
500
V
ns
ns
**
350
(I
S
= 1.0 A, V
GS
= 0 V,
d
IS
/d
t
= 100A/
μ
s)
* Pulse Test: Pulse Width
≦
300
μ
s, Duty Cycle
≦
2%
** Negligible, Dominated by circuit inductance