參數(shù)資料
型號(hào): CMQ82C55AZ
廠(chǎng)商: Intersil
文件頁(yè)數(shù): 18/26頁(yè)
文件大?。?/td> 0K
描述: IC I/O EXPANDER 24B 44MQFP
標(biāo)準(zhǔn)包裝: 960
接口: 可編程
輸入/輸出數(shù): 24
中斷輸出: 無(wú)
電源電壓: 4.5 V ~ 5.5 V
工作溫度: 0°C ~ 70°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 44-QFP
供應(yīng)商設(shè)備封裝: 44-MQFP(10x10)
包裝: 帶卷 (TR)
25
FN6140.2
June 15, 2006
MS82C55A, MQ82C55A, MP82C55A
Plastic Leaded Chip Carrier Packages (PLCC)
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions are
not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
4. To be measured at seating plane
contact point.
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
-C-
A1
A
SEATING
PLANE
0.020 (0.51)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.045 (1.14)
R
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
C
L
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.045 (1.14)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10)
C
-C-
D2/E2
C
L
N44.65 (JEDEC MS-018AC ISSUE A)
44 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.165
0.180
4.20
4.57
-
A1
0.090
0.120
2.29
3.04
-
D
0.685
0.695
17.40
17.65
-
D1
0.650
0.656
16.51
16.66
3
D2
0.291
0.319
7.40
8.10
4, 5
E
0.685
0.695
17.40
17.65
-
E1
0.650
0.656
16.51
16.66
3
E2
0.291
0.319
7.40
8.10
4, 5
N44
44
6
Rev. 2 11/97
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