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參數(shù)資料
| 型號(hào)： | CMM-5-BD-000V |
| 廠商： | MIMIX BROADBAND INC |
| 元件分類： | 放大器 |
| 英文描述： | 2000 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | 0.039 X 0.040 INCH, ROHS COMPLIANT, CHIP |
| 文件頁(yè)數(shù)： | 2/5頁(yè) |
| 文件大?。?/td> | 1146K |
| 代理商： | CMM-5-BD-000V |
2.0-6.0 GHz
GaAs MMIC Amplifier
Page 2 of 5
CMM-5-BD
Specifications (T
A
= 25oC, V
DD
= 6V, 2-6 GHz)
Die Attach and Bonding Procedures
Bonding Diagram
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
January 2007 - Rev 15-Jan-07
Die Attach:
Conductive epoxy or preform die attach is recom-
mended. For preform die attach: Preform: AuSn (80% Au, 20%
Sn); Stage Temperature: 290 oC, +/-5 oC; Handling Tool: Tweezers;
Time: 1 min or less.
Wire Bonding:
Wire Size: 0.7 to 1.0 mil in diameter (pre-
stressed); Thermocompression bonding is preferred over
thermosonic bonding. For thermocompression bonding: Stage
Temperature: 250 oC ; Bond Tip Temperature: 150 oC; Bonding
Tip Pressure: 18 to 40 gms depending on size of wire.
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