
Sep.1998
MITSUBISHI IGBT MODULES
CM400HU-24H
HIGH POWER SWITCHING USE
INSULATED TYPE
Absolute Maximum Ratings, T
j
 = 25 
°
C unless otherwise specified
Ratings
Symbol
CM400HU-24H
Units
°
C
°
C
Junction Temperature
T
j
-40 to 150
Storage Temperature
T
stg
V
CES
V
GES
I
C
I
CM
I
E
I
EM
P
c
–
-40 to 125
Collector-Emitter Voltage (G-E SHORT)
1200
Volts
Gate-Emitter Voltage (C-E SHORT)
±
20
Volts
Collector Current (T
c
 = 25
°
C)
Peak Collector Current (T
j
≤
 150
°
C)
Emitter Current** (T
c
 = 25
°
C)
Peak Emitter Current**
400
Amperes
800*
Amperes
400
Amperes
800*
Amperes
Maximum Collector Dissipation (T
c
 = 25
°
C)
Mounting Torque, M6 Main Terminal, M6 Mounting
2100
Watts
3.5~4.5
N · m
Mounting Torque, M4 Terminal
–
1.3~1.7
N · m
Weight
–
450
Grams
Isolation Voltage (Main Terminal to Baseplate, AC 1 min.)
V
iso
2500
Vrms
* Pulse width and repetition rate should be such that the device junction temperature (T
j
) does not exceed T
j(max)
 rating.
**Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
Static Electrical Characteristics, T
j
 = 25 
°
C unless otherwise specified
Characteristics
Symbol
       Test Conditions
Min.
Typ.
Max.
Units
Collector-Cutoff Current
I
CES
I
GES
V
GE(th)
V
CE(sat)
V
CE
 = V
CES
, V
GE
 = 0V
V
GE
 = V
GES
, V
CE
 = 0V
I
C
 = 40mA, V
CE
 = 10V
I
C
 = 400A, V
GE
 = 15V, T
j
 = 25
°
C
I
C
 = 400A, V
GE
 = 15V, T
j
 = 125
°
C
V
CC
 = 600V, I
C
 = 400A, V
GE
 = 15V
I
E 
= 400A, V
GE
 = 0V
–
–
2
mA
Gate Leakage Voltage
–
–
0.5
μ
A
Volts
Gate-Emitter Threshold Voltage
4.5
6
7.5
Collector-Emitter Saturation Voltage
–
2.9
3.7
Volts
–
2.85
–
Volts
Total Gate Charge
Q
G
V
EC
–
1500
–
nC
Emitter-Collector Voltage*
–
–
3.2
Volts
* Pulse width and repetition rate should be such that the device junction temperature (T
j
) does not exceed T
j(max)
 rating.
Dynamic Electrical Characteristics, T
j
 = 25 
°
C unless otherwise specified
Characteristics
Symbol
       Test Conditions
Min.
Typ.
Max.
Units
Input Capacitance
C
ies
C
oes
C
res
t
d(on)
t
r
t
d(off)
t
f
t
rr
Q
rr
–
–
60
nF
Output Capacitance
V
CE
 = 10V, V
GE
 = 0V
–
–
21
nF
Reverse Transfer Capacitance
–
–
12
nF
Resistive
Turn-on Delay Time
V
CC
 = 600V, I
C
 = 400A,
V
GE1
 = V
GE2
 = 15V,
R
G
 = 0.78
, Resistive
Load Switching Operation
–
–
250
ns
Load
Rise Time
–
–
350
ns
Switch
Turn-off Delay Time
–
–
350
ns
Times
Fall Time
–
–
350
ns
Diode Reverse Recovery Time
I
E
 = 400A, di
E
/dt = -800A/
μ
s
I
E
 = 400A, di
E
/dt = -800A/
μ
s
–
–
300
ns
Diode Reverse Recovery Charge
–
2.2
–
μ
C
Thermal and Mechanical Characteristics, T
j
 = 25 
°
C unless otherwise specified
Characteristics
Symbol
       Test Conditions
Min.
Typ.
Max.
Units
°
C/W
°
C/W
°
C/W
Thermal Resistance, Junction to Case
R
th(j-c)
Q
R
th(j-c)
D
R
th(c-f)
Per IGBT Module
–
–
0.06
Thermal Resistance, Junction to Case
Per FWDi Module
–
–
0.09
Contact Thermal Resistance
Per Module, Thermal Grease Applied
–
0.02
–