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參數(shù)資料
| 型號： | CM3107-00SN |
| 廠商： | California Micro Devices Corporation |
| 英文描述： | 2 Amp Source/ Sink Bus Termination Regulator for DDR Memory and Front Side Bus Applications |
| 中文描述： | 2安培源/ DDR內(nèi)存和前端總線接收器總線終端穩(wěn)壓器的應(yīng)用 |
| 文件頁數(shù)： | 9/13頁 |
| 文件大?。?/td> | 1214K |
| 代理商： | CM3107-00SN |
2004 California Micro Devices Corp. All rights reserved.
02/02/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
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Tel: 408.263.3214
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Fax: 408.263.7846
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www.calmicro.com
9
CM3107
Performance Information (cont’d)
Typical Thermal Characteristics (cont’d)
Front Side Bus Application
If the CM3107-00SN is instead used for the Front Side
Bus application, where VDDQ could be connected to
the 3.3V VCC rail for ease of connectivity, the power
dissipated will increase to [3.3V-1.4V] = 1.9V times the
sourcing current, or [1.4V - 0V] = 1.4V times the sink-
ing current.
So the worst case is with all FSB outputs low for a
period of time, such that the maximum average source
current at an ambient of 40°C is [0.73W / 1.9V] =
0.38A. If this average current is exceeded, the device
will go over-temperature and the output will drop to 0V.
If it is likely that this average current will be exceeded
for the FSB application, then the version with the heat
spreader, CM3107-00SB, should be used, or for com-
monality of device type for both applications, the VDDQ
pin should instead be connected to 2.5V. The maxi-
mum average source current at an ambient of 40°C is
[2.75W/1.9V] = 1.45A.
The theoretical calculations of these relationships
show the safe operating area of the CM3107 in the
SOIC and PSOP packages.
Thermal characteristics were measured using a double
sided board with two square inches of copper area
connected to the GND pins for "heat spreading".
Figure 14. Reference Voltage vs. Temperature
Measurements showing performance up to a junction
temperature of 150°C were performed under light load
conditions (5mA). This allows the ambient temperature
to be representative of the internal junction tempera-
ture.
Note: The use of multi-layer board construction with
separate ground and power planes will further enhance
the overall thermal performance.
Figure 15. Output Voltage vs. Ambient
Temperature (I
LOAD
=5mA)
Figure 16. Quiescent Current vs. Temperature
Figure 17.
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| CM3107-12SH | 2 Amp Source/ Sink Bus Termination Regulator for DDR Memory and Front Side Bus Applications |
| CM310701S | 2 Amp Source/ Sink Bus Termination Regulator for DDR Memory and Front Side Bus Applications |
| CM3112 | 150mA/1.2V CMOS LDO Regulator |
| CM3112-12 | 150mA/1.2V CMOS LDO Regulator |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CM310701S | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:2 Amp Source/ Sink Bus Termination Regulator for DDR Memory and Front Side Bus Applications |
| CM3107-12SH | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:2 Amp Source/ Sink Bus Termination Regulator for DDR Memory and Front Side Bus Applications |
| CM3108-000 | 制造商:TE Connectivity 功能描述:Heat Shrink Molded Boot 制造商:TE Connectivity 功能描述:222D232-25-02/225-0-CS8910 - Bulk |
| CM3108F10SL-3 | 制造商:EPIC 功能描述:CLAMP RIGHT ANGLE 10SL-3 |
| CM3108F10SL-3N | 制造商:EPIC 功能描述:CLAMP R/ANGLE 10SL-3N |
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