參數(shù)資料
型號(hào): CM3018-29CS
廠商: California Micro Devices Corporation
英文描述: Micropower, 150mA Low Noise CMOS Regulator with Fast Response
中文描述: 微功耗,150mA的低噪聲的CMOS穩(wěn)壓器的快速響應(yīng)
文件頁數(shù): 9/11頁
文件大?。?/td> 302K
代理商: CM3018-29CS
2004 California Micro Devices Corp. All rights reserved.
07/29/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
9
CM3018
PRELIMINARY
Performance Information (cont’d)
Typical Thermal Characteristics
The overall junction to ambient thermal resistance (
θ
JA
)
for device power dissipation (P
D
) consists primarily of
two paths in series. The first path is the junction to the
case (
θ
JC
) which is defined by the package style, and
the second path is case to ambient (
θ
CA
) thermal resis-
tance which is dependent on board layout. The final
operating junction temperature for any set of conditions
can be estimated by the following thermal equation:
T
JUNC
= T
AMB
+ P
D
(
θ
JC
) + P
D
(
θ
CA
)
= T
AMB
+ P
D
(
θ
JA
)
SOT-23 Package Considerations
When the SOT23 version of the CM3018 is mounted
on a double-sided printed circuit board with two square
inches of copper allocated for "heat spreading", the
resulting
θ
JA
is 175
°
C/W.
Based on a maximum power dissipation of 320mW
(Load x V
IN
-V
OUT
= 150mA x 2.2V) with an ambient of
70
°
C the resulting junction temperature will be:
T
JUNC
= T
AMB
+ P
D
(
θ
JA
)
= 70
°
C + 315mW
(175
°
C/W)
= 70
°
C + 57.75
°
C = 127.75
°
C
Thermal characteristics were measured using a double
sided board with two square inches of copper area
connected to the GND pins for “heat spreading”.
Measurements showing performance up to a junction
temperature of 125
°
C were performed under light load
conditions (1mA). This allows the ambient temperature
to be representative of the internal junction tempera-
ture.
Note:
The use of multi-layer board construction with
separate ground and power planes will further enhance
the overall thermal performance. In the event of no
copper area being dedicated for heat spreading, a
multi-layer board construction using only the minimum
size pad layout will typically provide the
CM3018
in a
SOT23 package with an overall
θ
JA
of 175
°
C/W, which
allows up to 450mW to be dissipated safely.
Please consult CAMD Technical Support for assistance
with thermal analysis of the CM3018 with respect to a
specific application.
Ground Current vs. Temperature
(VIN=5V)
0
20
40
60
80
100
0
25
50
75
100
125
TEMPERATURE [
o
C]
G
Output Voltage Change vs. Temperature
(VIN=5V, 1mA Load)
50
-50
-40
-30
-20
-10
0
10
20
30
40
-50
-25
0
25
50
75
100
125
TEMPERATURE [
o
C]
O
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