參數(shù)資料
型號： CM200DY-24NF
廠商： Mitsubishi Electric Corporation
英文描述： MITSUBISHI IGBT MODULES
中文描述： 三菱IGBT模塊
文件頁數(shù)： 2/4頁
文件大?。?/td> 93K
代理商： CM200DY-24NF
Mar.2003
V
CE
= V
CES
, V
GE
= 0V
V
GE
= V
GES
, V
CE
= 0V
T
j
= 25
°
C
T
j
= 125
°
C
V
CC
= 600V, I
C
= 200A, V
GE
= 15V
V
CC
= 600V, I
C
= 200A
V
GE1
= V
GE2
= 15V
R
G
= 1.6
, Inductive load switching operation
I
E
= 200A
I
E
= 200A, V
GE
= 0V
IGBT part (1/2 module)
FWDi part (1/2 module)
Case to fin, Thermal compound Applied
*2
(1/2 module)
Tc measured point is just under the chips
I
C
= 20mA, V
CE
= 10V
I
C
= 200A, V
GE
= 15V
V
CE
= 10V
V
GE
= 0V
1200
±
20
200
400
200
400
1130
–40 ~ +150
–40 ~ +125
2500
3.5 ~ 4.5
3.5 ~ 4.5
400
MITSUBISHI IGBT MODULES
CM200DY-24NF
HIGH POWER SWITCHING USE
V
V
A
A
A
A
W
°
C
°
C
V
N m
N m
g
1
0.5
2.5
—
47
4
0.9
—
500
150
600
350
250
—
3.2
0.11
0.19
—
0.066
*3
16
mA
μ
A
nF
nF
nF
nC
ns
ns
ns
ns
ns
μ
C
V
°
C/W
°
C/W
°
C/W
°
C/W
—
—
1.8
2.0
—
—
—
1350
—
—
—
—
—
7.5
—
—
—
0.04
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1.6
7
V
V
6
8
Collector cutoff current
Gate leakage current
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Reverse recovery time
Reverse recovery charge
Emitter-collector voltage
Contact thermal resistance
Thermal resistance
External gate resistance
*
1 : Tc measured point is shown in page OUTLINE DRAWING.
*
2 : Typical value is measured by using Shin-etsu Silicone “G-746”.
*
3 : Tc’ measured point is just under the chips.
If you use this value, R
th(f-a)
should be measured just under the chips.
Note 1. I
E
, V
EC
, t
rr
& Q
rr
represent characteristics of the anti-parallel, emitter to collector free-wheel diode (FWDi).
2. Pulse width and repetition rate should be such that the device junction temp. (T
j
) does not exceed T
jmax
rating.
3. Junction temperature (T
j
) should not increase beyond 150
°
C.
Gate-emitter threshold voltage
Collector-emitter saturation voltage
Thermal resistance
*1
I
CES
I
GES
C
ies
C
oes
C
res
Q
G
t
d(on)
t
r
t
d(off)
t
f
t
rr (
Note 1
)
Q
rr (
Note 1
)
V
EC(
Note 1
)
R
th(j-c)
Q
R
th(j-c)
R
R
th(c-f)
R
th(j-c’)
Q
R
G
Symbol
Parameter
V
GE(th)
V
CE(sat)
Collector-emitter voltage
Gate-emitter voltage
Maximum collector dissipation
Junction temperature
Storage temperature
Isolation voltage
Weight
G-E Short
C-E Short
DC, T
C
’ = 112
°
C
*3
Pulse
(Note 2)
Pulse
T
C
= 25
°
C
(Note 2)
Main Terminal to base plate, AC 1 min.
Main Terminal M6
Mounting holes M6
Typical value
Symbol
V
CES
V
GES
I
C
I
CM
I
E (
Note 1
)
I
EM (
Note 1
)
P
C (
Note 3
)
T
j
T
stg
V
iso
—
—
—
Parameter
Collector current
Emitter current
Torque strength
Conditions
Unit
Ratings
Unit
Typ.
Limits
Min.
Max.
MAXIMUM RATINGS
(Tj = 25
°
C)
ELECTRICAL CHARACTERISTICS
(Tj = 25
°
C)
Test conditions
相關(guān)PDF資料
PDF描述
CM200DY-28H HIGH POWER SWITCHING USE INSULATED TYPE
CM200DY-28H Dual IGBTMOD 200 Amperes/1400 Volts
CM200E3U-12H HIGH POWER SWITCHING USE INSULATED TYPE
CM200E3U-12H Chopper IGBTMOD 200 Amperes/600 Volts
CM200HA-24H HIGH POWER SWITCHING USE INSULATED TYPE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CM200DY-24NF_09 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:IGBT MODULES HIGH POWER SWITCHING USE
CM200DY-24NFH 制造商:Powerex Power Semiconductors 功能描述:POWER IGBT TRANSISTOR
CM200DY-28H 功能描述:IGBT MOD DUAL 1400V 200A H SER RoHS:否 類別:半導(dǎo)體模塊 >> IGBT 系列:IGBTMOD™ 標(biāo)準(zhǔn)包裝:10 系列:GenX3™ IGBT 類型:PT 配置:單一 電壓 - 集電極發(fā)射極擊穿（最大）:600V Vge, Ic時(shí)的最大Vce（開）:1.4V @ 15V，100A 電流 - 集電極 (Ic)（最大）:430A 電流 - 集電極截止（最大）:100µA Vce 時(shí)的輸入電容 (Cies):31nF @ 25V 功率 - 最大:1000W 輸入:標(biāo)準(zhǔn) NTC 熱敏電阻:無 安裝類型:底座安裝 封裝/外殼:SOT-227-4，miniBLOC 供應(yīng)商設(shè)備封裝:SOT-227B
CM200DY-34A 功能描述:IGBT MOD DUAL 1700V 200A A SER RoHS:是 類別:半導(dǎo)體模塊 >> IGBT 系列:IGBTMOD™ 標(biāo)準(zhǔn)包裝:10 系列:GenX3™ IGBT 類型:PT 配置:單一 電壓 - 集電極發(fā)射極擊穿（最大）:600V Vge, Ic時(shí)的最大Vce（開）:1.4V @ 15V，100A 電流 - 集電極 (Ic)（最大）:430A 電流 - 集電極截止（最大）:100µA Vce 時(shí)的輸入電容 (Cies):31nF @ 25V 功率 - 最大:1000W 輸入:標(biāo)準(zhǔn) NTC 熱敏電阻:無 安裝類型:底座安裝 封裝/外殼:SOT-227-4，miniBLOC 供應(yīng)商設(shè)備封裝:SOT-227B
CM200DY-34A_09 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:IGBT MODULES HIGH POWER SWITCHING USE
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價(jià)

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*