參數(shù)資料
型號(hào): CM1423-03CS
廠商: California Micro Devices Corporation
英文描述: Secure Digital (SD) Card EMI Filter Array with ESD Protection
中文描述: 安全數(shù)字(SD)卡EMI濾波器與ESD保護(hù)陣列
文件頁(yè)數(shù): 9/10頁(yè)
文件大小: 603K
代理商: CM1423-03CS
2005 California Micro Devices Corp. All rights reserved.
01/12/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
9
CM1423
Application Information (cont’d)
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
Figure 9. Recommended Non-Solder Mask Defined Pad Illustration
Figure 10. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 11. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
+50
μ
m
+20
μ
m
60 seconds
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Soldering Maximum Temperature
260°C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0
1:00.0
2:00.0
Time (minutes)
3:00.0
4:00.0
T
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