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參數(shù)資料
| 型號： | CM1300 |
| 英文描述： | 4-Channel EMI/RFI Filter Network in Chip Scale Package with Lead-free Finishing and OptiGuard? Coating (CSPRC032A pin compatible) |
| 中文描述： | 4通道的EMI /在芯片級封裝RFI濾波器網(wǎng)絡(luò)與無鉛整理和OptiGuard？涂料（CSPRC032A引腳兼容） |
| 文件頁數(shù)： | 4/5頁 |
| 文件大?。?/td> | 420K |
| 代理商： | CM1300 |
2003 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
11/11/03
CM1300
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration
Figure 2. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 3. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
+50
μ
m
+20
μ
m
60 seconds
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Soldering Maximum Temperature
260°C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0
1:00.0
2:00.0
Time (minutes)
3:00.0
4:00.0
T
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