參數(shù)資料
型號: CM1205-16CS
廠商: California Micro Devices Corporation
英文描述: ESD Protection Arrays, Chip Scale Package
中文描述: ESD保護(hù)陣列,芯片級封裝
文件頁數(shù): 2/7頁
文件大小: 167K
代理商: CM1205-16CS
2003 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
11/17/03
CM1205
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
120516
3
2
5
4
1
B
A
D
C
Orientation
Marking
(see note 2)
120508
3
2
5
4
1
B
A
Orientation
Marking
(see note 2)
L05
3
2
1
B
A
Orientation
Marking
(see note 2)
C3
D3
C2
C1
D2
D1
C5
D5
C4
D4
A3
B3
A2
A1
B2
B1
A5
B5
A4
B4
A3
B3
A2
A1
B2
B1
A5
B5
A4
B4
A3
B3
A2
A1
B2
B1
CM1405-04
CSP Package
PACKAGE / PINOUT DIAGRAMS
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
CM1405-08
CSP Package
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
CSP Package
CM1405-16
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
PART NUMBERING INFORMATION
Bumps
Package
Standard Finish
Lead-free Finish
2
Ordering Part
Number
1
Part Marking
Ordering Part
Number
1
Part Marking
6
CSP
CM1205-04CS
L05
CM1205-04CP
L05
10
CSP
CM1205-08CS
120508
CM1205-08CP
120508
20
CSP
CM1205-16CS
120516
CM1205-16CP
120516
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