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參數(shù)資料
| 型號： | CLP200M |
| 廠商： | 意法半導體 |
| 英文描述： | OVERVOLTAGE AND OVERCURRENT PROTECTION FOR TELECOM LINE |
| 中文描述： | 過壓和過流保護的電信線路保護 |
| 文件頁數(shù)： | 19/21頁 |
| 文件大?。?/td> | 232K |
| 代理商： | CLP200M |
PowerSo-10package mountedon
R
th
(j-a)
P Diss (*)
1.FR4 using therecommendedpad-layout
50
°
C/W
1.5 W
2.FR4 withheatsinkon board(6cm
2
)
35
°
C/W
2.0 W
3.FR4 withcopper-filledthroughholes and externalheatsinkapplied
12
°
C/W
5.8 W
4. IMSfloating inair (40cm
2
)
8
°
C/W
8.8 W
5. IMSwith externalheatsinkapplied
3.5
°
C/W
20 W
(*)Basedon a delta T of 70
°
C junctiontrain.
TABLE1 : THERMALIMPEDANCE VERSUSSUBSTRATE
A newtechnologyavailabletodayis IMS - an Insu-
lated Metallic Substrate. This offers greatly en-
hanced
thermal
characteristics
mount components. IMS is a substrate consisting
of threedifferentlayers, (I)the basematerialwhich
is availableas an aluminiumor a copper plate, (II)
a thermal conductive dielectrical layer and (III) a
copper foil,which can be etchedas a circuit layer.
Using this material a thermal resistance of 8
°
C/W
with 40 cm
2
of board floating in air is achievable
(seefig.4). Ifevenhigherpower is tobe dissipated
for
surface
an externalheatsink could be appliedwhich leads
to an R
th
(j-a) of 3.5
°
C/W (see Fig. 5), assuming
that R
th
(heatsink-air) is equal to R
th
(junction-
heatsink). This is commonly applied in practice,
leading to reasonableheatsink dimensions. Often
power devices are defined by considering the
maximum junction temperature of the device. In
practice , however,this is farfrom beingexploited.
A summary of various power management capa-
bilities is made in table 1 based on a reasonable
delta T of 70
°
Cjunctionto air.
Fig 4 :
Mounting on metalbackedboard
Fig 5 :
Mounting on metal backed board with an
externalheatsinkapplied
FR4board
Copperfoil
Aluminium
heatsink
Copper foil
Insulation
Aluminium
The PowerSO-10 concept also represents an at-
tractive alternative to C.O.B. techniques. Pow-
erSO-10offers devices fullytestedat lowand high
temperature. Mounting is simple - only conven-
tionalSMTis required- enablingtheuserstoget rid
of bond wire problems and the problem to control
thehigh temperaturesoft solderingas well. An op-
timized
thermal
management is
through PowerSO-10 as the power chips must in
any case be mounted on heat spreaders before
beingmountedonto thesubstrate.
guaranteed
CLP200M
19/21
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