
(1,27mm) .050"
CLP SERIES
LOW PROFILE DUAL WIPE SOCKET
High reliability
Tiger Claw
contacts
CLP–110–02–F–D–P
CLP–130–02–L–D
CLP–116–02–F–DH
CLP–116–02–L–D
Surface
Mount
Low Profile
(2,21mm)
.087"
(1,27mm x 1,27mm)
.050" x .050"
micro pitch
Suitable for pass-through
applications
WWW.SAMTEC.COM
1
OTHER
OPTION
PLATING
OPTION
02 thru 50
NO. PINS
PER ROW
CLP
02
–BE
= Bottom Entry
(Required for bottom entry
applications)
–A
= Alignment Pin
(Not available with –PA option)
(5, 10, 25 position only)
(–DH option and other sizes.
Call Samtec)
–K
= (4,00mm) .157" DIA Polyimide
film Pick & Place Pad
(5 positions min.)
–P
= Pick & Place Pad
(5 positions min. –D only)
(Not always necessary
for auto placement.
See Flex Processing.)
–PA
= Pick & Place Pad
with Alignment Pin
(–D only)
(Not Available with –A option)
–TR
= Tape & Reel
Mates with:
FTSH, FTS,
FW, FFDL2
ROW
OPTION
–D
= Double
Row
–DH
= Double
Horizontal
(Requires
FTSH or
FSH –01
lead style)
Single row available.
(Mates with FTS Series)
Call Samtec.
Single row options available.
Call Samtec.
APPLICATION
ALSO
AVAILABLE
No. of Positions
x (1,27) .050 + (0,43) .017
(1,27)
.050
(1,27)
.050
(0,41)
.016
(3,05)
.120
(4,57)
.180
(4,32)
.170
(2,44)
.096
(6,35)
.250
x
(3,18)
.125
99
100
01
02
(2,26)
.089
(3,43)
.135
(0,89)
.035 DIA
(7,00)
.275
–PA OPTION
(3,00)
.118
(1,40)
.055
(8,25)
.325
A
A
(3,56) .140
(7,11) .280
PIN/ROW
04-15
16-50
For complete specifications and
recommended PCB layouts
see www.samtec.comCLP
Insulator Material:
Black Liquid Crystal
Polymer
Contact Material:
Phosphor Bronze
Plating:
Sn or Au over
50μ" (1,27μm) Ni
Current Rating:
1.75A @ 80°C ambient
Operating Temp Range:
-55°C to +125°C
Contact Resistance:
10 m
Ω
max
Insertion Depth:
Top Entry = (1,40mm) .055"
minimum, Bottom Entry =
(2,41mm) .095" minimum
plus board thickness
DH Entry = (2,31mm) .091"
to (2,67mm) .105"
Insertion Force:
(Single contact only)
3.8oz (1,05N) average
Normal Force:
60 grams (0,59N) average
Withdrawal Force:
(Single contact only)
2oz (0,56N) average
Max Cycles:
100 with 10μ" (0,25μm) Au
RoHS Compliant:
Yes
Processing:
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (02-35)
(0,15mm) .006" max (36-50)
–DH
–D
–P OPTION
F-211
If odd pins/row, alignment
pins are on middle position
on centerline of the part.
If even pins/row, then
alignment pins are between
middle two positions.
–F
= Gold flash on
contact, Matte
Tin on tail
–L
= 10μ" (0,25μm)
Gold on contact,
Matte Tin on tail
–G
= 10μ" (0,25μm)
Gold
(–D only)
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
SPECIFICATIONS
5,13mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
Performance data for other stack heights and complete
test data available at www.samtec.comCLP
or contact sig@samtec.com
7.0 GHz / 14 Gbps
8.5 GHz / 17 Gbps
Rated @ 3dB Insertion Loss
1,27mm FTSH/CLP
17,7mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
Performance data for other stack heights and complete
test data available at www.samtec.comCLP
or contact sig@samtec.com
3.0 GHz / 6.0 Gbps
4.0 GHz / 8.0 Gbps
Rated @ 3dB Insertion Loss
1,27mm FW/CLP
PASS-THRU
APPLICATIONS
HORIZONTAL
CLP
FTSH
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 30μ" Gold
Call Samtec for maximum cycles
TM
Note:
Other Gold plating
options available.
Contact Samtec.