參數(shù)資料
型號: CLC452A8B
英文描述: Current-Feedback Operational Amplifier
中文描述: 電流反饋運算放大器
文件頁數(shù): 9/12頁
文件大?。?/td> 198K
代理商: CLC452A8B
9
http://www.national.com
Transmission Line Matching
One method for matching the characteristic impedance
(Z
o
) of a transmission line or cable is to place the
appropriate resistor at the input or output of the amplifier.
Figure 7 shows typical inverting and non-inverting circuit
configurations for matching transmission lines.
Figure 7: Transmission Line Matching
Non-inverting gain applications:
I
Connect R
g
directly to ground.
I
Make R
1
, R
2
, R
6
, and R
7
equal to Z
o
.
I
Use R
3
to isolate the amplifier from reactive
loading caused by the transmission line,
or by parasitics.
Inverting gain applications:
I
Connect R
3
directly to ground.
I
Make the resistors R
4
, R
6
, and R
7
equal to Z
o
.
I
Make R
5
II R
g
= Z
o
.
The input and output matching resistors attenuate the
signal by a factor of 2, therefore additional gain is needed.
Use C
6
to match the output transmission line over a
greater frequency range. C
6
compensates for the increase
of the amplifier’s output impedance with frequency.
Power Dissipation
Follow these steps to determine the power consumption
of the CLC450:
1. Calculate the quiescent (no-load) power:
P
amp
= I
CC
(V
CC
- V
EE
)
2. Calculate the RMS power at the output stage:
P
o
= (V
CC
- V
load
) (I
load
), where V
load
and I
load
are the RMS voltage and current across the
external load.
3. Calculate the total RMS power:
P
t
= P
amp
+ P
o
The maximum power that the DIP, SOIC, and SOT
packages can dissipate at a given temperature is
illustrated in Figure 8. The power derating curve for
any CLC450 package can be derived by utilizing the
following equation:
where
T
amb
= Ambient temperature (°C)
θ
JA
= Thermal resistance, from junction to ambient,
for a given package (°C/W)
Figure 8: Power Derating Curves
Layout Considerations
A proper printed circuit layout is essential for achieving
high frequency performance. Comlinear provides
evaluation boards for the CLC450 (730013-DIP, 730027-
SOIC, 730068-SOT) and suggests their use as a guide
for high frequency layout and as an aid for device testing
and characterization.
General layout and supply bypassing play major roles in
high frequency performance. Follow the steps below as
a basis for high frequency layout:
I
Include 6.8
μ
F tantalum and 0.1
μ
F ceramic
capacitors on both supplies.
I
Place the 6.8
μ
F capacitors within 0.75 inches
of the power pins.
I
Place the 0.1
μ
F capacitors less than 0.1 inches
from the power pins.
I
Remove the ground plane under and around the
part, especially near the input and output pins to
reduce parasitic capacitance.
I
Minimize all trace lengths to reduce series
inductances.
I
Use flush-mount printed circuit board pins for
prototyping, never use high profile DIP sockets.
Evaluation Board Information
Data sheets are available for the CLC730013/
CLC730027 and CLC730068 evaluation boards. The
evaluation board data sheets provide:
I
Evaluation board schematics
I
Evaluation board layouts
I
General information about the boards
The CLC730013/CLC730027 data sheet also contains
tables of recommended components to evaluate several
of Comlinear’s high speed amplifiers. This table for the
CLC450 is illustrated below. Refer to the evaluation
board data sheet for schematics and further information.
Components Needed to Evaluate the
CLC450 on the Evaluation Board:
I
R
f
, R
g
- Use this product data sheet to select values
I
R
in
, R
out
- Typically 50
(Refer to the
Basic
Operation
section of the evaluation board data
sheet for details)
(175
T
amb
JA
°
θ
)
P
Ambient Temperature (
°
C)
0
0.2
0.4
0.6
0.8
1.0
-40 -20
0
20
40
60
80 100 120
180
AJP
AJE
SOT
140 160
CLC450
-
+
R
3
Z
0
R
6
V
o
Z
0
R
1
R
2
+
R
g
Z
0
R
4
R
5
V
1
V
2
+
R
f
C
6
R
7
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