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參數(shù)資料
| 型號(hào)： | CE71T3 |
| 廠商： | Fujitsu Limited |
| 英文描述： | 0.25um CMOS Technology |
| 中文描述： | 0.25微米CMOS工藝 |
| 文件頁(yè)數(shù)： | 3/4頁(yè) |
| 文件大小： | 65K |
| 代理商： | CE71T3 |
PACKAGE AVAILABILITY
No. of Pins
Frame Size
Thin and Low Profile QFP Packages (0.4, 0.5 mmlead pitch)
100
K1, K2
120
K2, K3
144
K3, K4, K8, T2, T3
176
K4, K5, T3, T4
208
T4, T5, T6, T7, T8, T9
256
T8, T9, TA, TB, TC
Shrink QFP Package (0.5 mmlead pitch)
176
J1, J2, K4, K5
208
J3, J4, J5, K5, K6, K7, K8
240
J4, J5, J6, K6, K7, K8
Heatspreader QFP Package (0.4, 0.5 mmlead pitch)
208
J3, J4, J5, J6, J7, J8, J9, K5, K6, K7, K8
T4, T5, T6, T7, T8, T9
240
J4, J5, J6, J7, J8, J9, JA, K6, K7, K8, T6, T7, T8, T9, TA
256
J5, J6, J7, J8, J9, T7, T8, T9, TA, TB, TC
304
J7, J8, J9, JA, JB, JC, JD, JE, JF, JG, TB, TC, TD, TE, TG
Ball Grid Array (1.27 mmball pitch)
256
J3, J4, T7, T8, T9, TA, TB
352
J6, J7, J8, TB, TC, TD
420
J8, J9, TD, TE
576
JA, JB
672
JC, JD
Fine-Pitch Ball Grid Array (0.75, 0.8 mmball pitch)
144
T3
176
T3, T4
224
T5, T6, T7, T8, T9
288
T8, T9, TA, TB, TC
Tab Ball Grid Array (0.8, 1.0 mmball pitch)
304
L4, L5
352
L5, L6, L7
480
L6, L7
560
L7, L8, LB, LC
660
L8, L9
720
L9, LA, LB, LC, LD, LE
025
μ
mCMO Technoogy
Fujitsu Microelectronics, Inc.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CE71T4 | 0.25um CMOS Technology |
| CE71T5 | 0.25um CMOS Technology |
| CE71T6 | 0.25um CMOS Technology |
| CE71T7 | 0.25um CMOS Technology |
| CE71T8 | 0.25um CMOS Technology |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CE71T4 | 制造商:FUJITSU 制造商全稱(chēng):Fujitsu Component Limited. 功能描述:0.25um CMOS Technology |
| CE71T5 | 制造商:FUJITSU 制造商全稱(chēng):Fujitsu Component Limited. 功能描述:0.25um CMOS Technology |
| CE71T6 | 制造商:FUJITSU 制造商全稱(chēng):Fujitsu Component Limited. 功能描述:0.25um CMOS Technology |
| CE71T7 | 制造商:FUJITSU 制造商全稱(chēng):Fujitsu Component Limited. 功能描述:0.25um CMOS Technology |
| CE71T8 | 制造商:FUJITSU 制造商全稱(chēng):Fujitsu Component Limited. 功能描述:0.25um CMOS Technology |
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