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參數資料
| 型號： | CDR32BX109ADUP |
| 廠商： | KEMET Corporation |
| 元件分類： | 電容 |
| 英文描述： | CERAMIC CHIP/MIL-PRF-55681 |
| 中文描述： | 陶瓷芯片/mil-prf-55681 |
| 文件頁數： | 9/10頁 |
| 文件大?。?/td> | 949K |
| 代理商： | CDR32BX109ADUP |
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Embossed Carrier Tape Configuration (cont.)
Sketch D: Tape Camber (Top View)
Allowable camber to be 1 mm/250 mm.
250mm (9.843)
1mm (0.039) Max.
Table 2 – REEL DIMENSIONS (Metric will govern)
Figure 3:
Reel Dimensions (Metric Dimensions will govern)
Tape Size
A Max
B* Min
C
D* Min
N Min
W
1
W
2 Max
W
3
8 mm
330.0
1.5
13.0 ± 0.20
20.2
50.0
8.4
14.4
7.9 Min
(12.992)
(0.059)
(0.512 ± 0.008)
(0.795)
(1.969)
+1.5, -0.0
(0.567)
(0.311)
See
(0.331
10.9 Max
Note 3
+0.059, -0.0)
(0.429)
12 mm
330.0
1.5
13.0 ± 0.20
20.2
Table 1
12.4
18.4
11.9 Min
(12.992)
(0.059)
(0.512 ± 0.008)
(0.795)
+2.0, -0.0
(0.724)
(0.469)
(0.488
15.4 Max
+0.078, -0.0)
(0.606)
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Figure 2:
Tape Leader
& Trailer
Dimensions
(Metric
Dimensions
Will Govern)
400mm (15.75) Min.
20°
95
Packaging
相關PDF資料 |
PDF描述 |
|---|---|
| CDR32BX109ADUR | CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109ADWM | CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109ADWP | CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109ADWR | CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109BBSM | CERAMIC CHIP/MIL-PRF-55681 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| CDR32BX109ADUR | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109ADWM | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109ADWP | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109ADWR | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109BBSM | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
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