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參數(shù)資料
| 型號(hào)： | CDR04BP222B3W4 |
| 廠商： | KEMET Corporation |
| 英文描述： | CERAMIC CHIP CAPACITORS |
| 中文描述： | 陶瓷芯片電容器 |
| 文件頁(yè)數(shù)： | 29/30頁(yè) |
| 文件大?。?/td> | 2058K |
| 代理商： | CDR04BP222B3W4 |
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KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
20
°
20
°
Maximum
Typical
Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):
Table 1: 8 & 12mm Punched Tape
(
Metric Dimensions Will Govern)
Variable Dimensions - Millimeters (Inches)
Note:
1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from the
body and/or the body dimensions of the component. The clearance between the ends of the terminals or
body of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002)
minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component
within the cavity of not more than 20 degrees (see sketches A and B).
2. Tape with components shall pass around radius "R" without damage.
3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.
8mm
and
12mm
1.5
+0.10, -0.0
(.059
+0.004, -0.0)
1.75
±
0.10
(.069
±
0.004)
4.0
±
0.10
(.157
±
0.004)
2.0
±
0.05
(.079
±
0.002)
0.10
(.004)
Max.
0.75
(.030)
Min.
0.75
(.030)
Min.
25 (.984)
See Note 2
Table 1
Tape
Size
D
0
P
0
E
P
2
T
1
G
1
G
2
R Min.
8mm
1/2
Pitch
2.0
±
0.10
(.079
±
.004)
See Require-
ments
Section 3.3 (d)
4.0
±
0.10
(0.157
±
.004)
3.5
±
0.05
(.138
±
.002)
8.0
±
0.3
(.315
±
0.012)
See Note 1
Table 1
1.1mm (.043)
Max. for Paper
Base Tape and
1.6mm (.063)
Max. for Non-
Paper Base
Compositions.
See Note 3.
Tape
Size
P
1
W
F
A
0
B
0
T
8mm
12mm
4.0
±
0.10
(0.157
±
.004)
8.0
±
0.10
(0.315
±
.004)
12mm
Double
Pitch
12.0
±
0.3
(.472
±
.012)
5.5
±
0.05
(.217
±
.002)
Table 1: 8 & 12mm Punched Tape
(
Metric Dimensions Will Govern)
Constant Dimensions - Millimeters (Inches)
Sketch B:
Max. Component
Rotation - Front
Cross Sectional View
Sketch C:
Component Rotation - Top View
A
0
B
0
P
1
P
0
P
2
D
0
F
E
W
Center lines
of cavity
10 pitches cumulative
tolerance on tape
±
0.2 (
±
0.008)
Top
Tape
Cover
T
User Direction of Feed
T
1
Max. Cavity Size
See Note 1
Table 1
Bottom
Tape
Cover
G
2
R
Sketch A:
Bending Radius
See Note 2
Table 1
CERAMIC CHIP CAPACITORS
Packaging Information
96
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CDR04BP222BJUR\M | 制造商:AVX Corporation 功能描述:CAP 0.0022UF 100VDC C0G 5% SMD 1812 0.01% - Tape and Reel |
| CDR04BP222BJUS | 功能描述:CAP CER 2200PF 100V BP 1812 制造商:kemet 系列:軍用，MIL-PRF-55681，CDR04 包裝:帶卷（TR） 零件狀態(tài):在售 電容:2200pF 容差:±5% 電壓 - 額定:100V 溫度系數(shù):BP 工作溫度:-55°C ~ 125°C 特性:- 等級(jí):- 應(yīng)用:通用 故障率:S（0.001%） 安裝類型:表面貼裝，MLCC 封裝/外殼:1812（4532 公制） 大小/尺寸:0.180" 長(zhǎng) x 0.125" 寬 (4.57mm x 3.18mm) 高度 - 安裝（最大值）:- 厚度（最大值）:0.080"（2.03mm） 引線間距:- 引線形式:- 標(biāo)準(zhǔn)包裝:7,500 |
| CDR04BP222BJWS | 制造商:AVX Corporation 功能描述:CAP 0.0022UF 100VDC C0G 5% SMD 1812 0.001% - Bulk |
| CDR04BP222BJWS\\1 | 制造商:AVX Corporation 功能描述:CAP MLCC - Tape and Reel |
| CDR04BP222BJWS\\6 | 制造商:AVX Corporation 功能描述:SMP MLC HI-REL - Gel-pak, waffle pack, wafer, diced wafer on film |
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