- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄375674 > CDR03BX223B3W4 (KEMET Corporation) CERAMIC CHIP CAPACITORS PDF資料下載
參數(shù)資料
| 型號(hào)： | CDR03BX223B3W4 |
| 廠商： | KEMET Corporation |
| 英文描述： | CERAMIC CHIP CAPACITORS |
| 中文描述： | 陶瓷芯片電容器 |
| 文件頁數(shù)： | 29/30頁 |
| 文件大?。?/td> | 2058K |
| 代理商： | CDR03BX223B3W4 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁當(dāng)前第29頁第30頁
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
20
°
20
°
Maximum
Typical
Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):
Table 1: 8 & 12mm Punched Tape
(
Metric Dimensions Will Govern)
Variable Dimensions - Millimeters (Inches)
Note:
1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from the
body and/or the body dimensions of the component. The clearance between the ends of the terminals or
body of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002)
minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component
within the cavity of not more than 20 degrees (see sketches A and B).
2. Tape with components shall pass around radius "R" without damage.
3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.
8mm
and
12mm
1.5
+0.10, -0.0
(.059
+0.004, -0.0)
1.75
±
0.10
(.069
±
0.004)
4.0
±
0.10
(.157
±
0.004)
2.0
±
0.05
(.079
±
0.002)
0.10
(.004)
Max.
0.75
(.030)
Min.
0.75
(.030)
Min.
25 (.984)
See Note 2
Table 1
Tape
Size
D
0
P
0
E
P
2
T
1
G
1
G
2
R Min.
8mm
1/2
Pitch
2.0
±
0.10
(.079
±
.004)
See Require-
ments
Section 3.3 (d)
4.0
±
0.10
(0.157
±
.004)
3.5
±
0.05
(.138
±
.002)
8.0
±
0.3
(.315
±
0.012)
See Note 1
Table 1
1.1mm (.043)
Max. for Paper
Base Tape and
1.6mm (.063)
Max. for Non-
Paper Base
Compositions.
See Note 3.
Tape
Size
P
1
W
F
A
0
B
0
T
8mm
12mm
4.0
±
0.10
(0.157
±
.004)
8.0
±
0.10
(0.315
±
.004)
12mm
Double
Pitch
12.0
±
0.3
(.472
±
.012)
5.5
±
0.05
(.217
±
.002)
Table 1: 8 & 12mm Punched Tape
(
Metric Dimensions Will Govern)
Constant Dimensions - Millimeters (Inches)
Sketch B:
Max. Component
Rotation - Front
Cross Sectional View
Sketch C:
Component Rotation - Top View
A
0
B
0
P
1
P
0
P
2
D
0
F
E
W
Center lines
of cavity
10 pitches cumulative
tolerance on tape
±
0.2 (
±
0.008)
Top
Tape
Cover
T
User Direction of Feed
T
1
Max. Cavity Size
See Note 1
Table 1
Bottom
Tape
Cover
G
2
R
Sketch A:
Bending Radius
See Note 2
Table 1
CERAMIC CHIP CAPACITORS
Packaging Information
96
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CDR03BX273BKW4 | CERAMIC CHIP CAPACITORS |
| CDR03BX333B3W4 | CERAMIC CHIP CAPACITORS |
| CDR04BP122BJW4 | CERAMIC CHIP CAPACITORS |
| CDR04BP152B3W4 | CERAMIC CHIP CAPACITORS |
| CDR04BP182BJW4 | CERAMIC CHIP CAPACITORS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CDR03BX223BKMR\1 | 制造商:AVX Corporation 功能描述:SMP MLC HI-REL - Tape and Reel |
| CDR03BX223BKSP | 制造商:AVX Corporation 功能描述:CAP 0.022UF 100VDC X7R 10% SMD 1808 0.1% - Bulk |
| CDR03BX223BKSR | 制造商:AVX Corporation 功能描述:CAP 0.022UF 100VDC X7R 10% SMD 1808 0.01% - Bulk |
| CDR03BX223BKSR\\1 | 制造商:AVX Corporation 功能描述:SMP MLC HI-REL - Custom Tape W/Leader |
| CDR03BX223BKSR\1 | 制造商:AVX Corporation 功能描述:SMP MLC HI-REL - Tape and Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。