參數(shù)資料
型號(hào)： CDR02BX101ABUP
廠商： KEMET Corporation
元件分類： 電容
英文描述： CERAMIC CHIP/MIL-PRF-55681
中文描述： 陶瓷芯片/mil-prf-55681
文件頁(yè)數(shù)： 9/10頁(yè)
文件大?。?/td> 949K
代理商： CDR02BX101ABUP
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
20
°
20
°
Maximum
Typical
Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):
Table 1: 8 & 12mm Punched Tape
(
Metric Dimensions Will Govern)
Variable Dimensions - Millimeters (Inches)
Note:
1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from the
body and/or the body dimensions of the component. The clearance between the ends of the terminals or
body of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002)
minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component
within the cavity of not more than 20 degrees (see sketches A and B).
2. Tape with components shall pass around radius "R" without damage.
3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.
8mm
and
12mm
1.5
+0.10, -0.0
(.059
+0.004, -0.0)
1.75
±
0.10
(.069
±
0.004)
4.0
±
0.10
(.157
±
0.004)
2.0
±
0.05
(.079
±
0.002)
0.10
(.004)
Max.
0.75
(.030)
Min.
0.75
(.030)
Min.
25 (.984)
See Note 2
Table 1
Tape
Size
D
0
P
0
E
P
2
T
1
G
1
G
2
R Min.
8mm
1/2
Pitch
2.0
±
0.10
(.079
±
.004)
See Require-
ments
Section 3.3 (d)
4.0
±
0.10
(0.157
±
.004)
3.5
±
0.05
(.138
±
.002)
8.0
±
0.3
(.315
±
0.012)
See Note 1
Table 1
1.1mm (.043)
Max. for Paper
Base Tape and
1.6mm (.063)
Max. for Non-
Paper Base
Compositions.
See Note 3.
Tape
Size
P
1
W
F
A
0
B
0
T
8mm
12mm
4.0
±
0.10
(0.157
±
.004)
8.0
±
0.10
(0.315
±
.004)
12mm
Double
Pitch
12.0
±
0.3
(.472
±
.012)
5.5
±
0.05
(.217
±
.002)
Table 1: 8 & 12mm Punched Tape
(
Metric Dimensions Will Govern)
Constant Dimensions - Millimeters (Inches)
Sketch B:
Max. Component
Rotation - Front
Cross Sectional View
Sketch C:
Component Rotation - Top View
A
0
B
0
P
1
P
0
P
2
D
0
F
E
W
Center lines
of cavity
10 pitches cumulative
tolerance on tape
±
0.2 (
±
0.008)
Top
Tape
Cover
T
User Direction of Feed
T
1
Max. Cavity Size
See Note 1
Table 1
Bottom
Tape
Cover
G
2
R
Sketch A:
Bending Radius
See Note 2
Table 1
CERAMIC CHIP CAPACITORS
Packaging Information
96
相關(guān)PDF資料
PDF描述
CDR02BX101ABUR CERAMIC CHIP/MIL-PRF-55681
CDR02BX101ABWM CERAMIC CHIP/MIL-PRF-55681
CDR02BX101ABWP CERAMIC CHIP/MIL-PRF-55681
CDR02BX101ABWR CERAMIC CHIP/MIL-PRF-55681
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CDR02BX101ABUR 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681
CDR02BX101ABWM 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681
CDR02BX101ABWP 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681
CDR02BX101ABWR 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681
CDR02BX101ACSM 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681
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